ADC, Flash Method, 8-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Exar |
Parts packaging code | DIP |
package instruction | DIP, DIP28,.6 |
Contacts | 28 |
Reach Compliance Code | unknown |
ECCN code | 3A001.A.2.C |
Maximum analog input voltage | 5 V |
Converter type | ADC, FLASH METHOD |
JESD-30 code | R-GDIP-T28 |
JESD-609 code | e0 |
Maximum linear error (EL) | 0.5859% |
Number of analog input channels | 1 |
Number of digits | 8 |
Number of functions | 1 |
Number of terminals | 28 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
Output bit code | BINARY |
Output format | PARALLEL, 8 BITS |
Package body material | CERAMIC, GLASS-SEALED |
encapsulated code | DIP |
Encapsulate equivalent code | DIP28,.6 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 5 V |
Certification status | Not Qualified |
Sampling rate | 10 MHz |
Sample and hold/Track and hold | SAMPLE |
Maximum seat height | 5.89 mm |
Maximum slew rate | 90 mA |
Nominal supply voltage | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 15.24 mm |
MP7684TD | MP7684KS | |
---|---|---|
Description | ADC, Flash Method, 8-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28 | ADC, Flash Method, 8-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, PDSO28, 0.335 INCH, EIAJ, SOIC-28 |
Is it Rohs certified? | incompatible | incompatible |
Maker | Exar | Exar |
Parts packaging code | DIP | SOIC |
package instruction | DIP, DIP28,.6 | SOP, SOP28,.5 |
Contacts | 28 | 28 |
Reach Compliance Code | unknown | compliant |
ECCN code | 3A001.A.2.C | EAR99 |
Maximum analog input voltage | 5 V | 5 V |
Converter type | ADC, FLASH METHOD | ADC, FLASH METHOD |
JESD-30 code | R-GDIP-T28 | R-PDSO-G28 |
JESD-609 code | e0 | e0 |
Maximum linear error (EL) | 0.5859% | 0.5859% |
Number of analog input channels | 1 | 1 |
Number of digits | 8 | 8 |
Number of functions | 1 | 1 |
Number of terminals | 28 | 28 |
Maximum operating temperature | 125 °C | 85 °C |
Minimum operating temperature | -55 °C | -40 °C |
Output bit code | BINARY | BINARY |
Output format | PARALLEL, 8 BITS | PARALLEL, 8 BITS |
Package body material | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY |
encapsulated code | DIP | SOP |
Encapsulate equivalent code | DIP28,.6 | SOP28,.5 |
Package shape | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | SMALL OUTLINE |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED |
power supply | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified |
Sampling rate | 10 MHz | 10 MHz |
Sample and hold/Track and hold | SAMPLE | SAMPLE |
Maximum seat height | 5.89 mm | 2.9 mm |
Maximum slew rate | 90 mA | 90 mA |
Nominal supply voltage | 5 V | 5 V |
surface mount | NO | YES |
technology | CMOS | CMOS |
Temperature level | MILITARY | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | GULL WING |
Terminal pitch | 2.54 mm | 1.27 mm |
Terminal location | DUAL | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED |
width | 15.24 mm | 8.4 mm |