HC/UH SERIES, 8-BIT DRIVER, INVERTED OUTPUT, CDIP20, CERAMIC, DIP-20
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Texas Instruments |
| Parts packaging code | DIP |
| package instruction | DIP, DIP20,.3 |
| Contacts | 20 |
| Reach Compliance Code | unknown |
| Other features | BROADSIDE VERSION OF 533 |
| series | HC/UH |
| JESD-30 code | R-GDIP-T20 |
| JESD-609 code | e0 |
| length | 24.51 mm |
| Load capacitance (CL) | 50 pF |
| Logic integrated circuit type | BUS DRIVER |
| Number of digits | 8 |
| Number of functions | 1 |
| Number of ports | 2 |
| Number of terminals | 20 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Output characteristics | 3-STATE |
| Output polarity | INVERTED |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP20,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 2/6 V |
| propagation delay (tpd) | 35 ns |
| Certification status | Not Qualified |
| Maximum seat height | 5.08 mm |
| Maximum supply voltage (Vsup) | 6 V |
| Minimum supply voltage (Vsup) | 2 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 7.62 mm |
| MM54HC563J | MM74HC563WMX | MM74HC563N | MM54HC563E | MM74HC563WM | |
|---|---|---|---|---|---|
| Description | HC/UH SERIES, 8-BIT DRIVER, INVERTED OUTPUT, CDIP20, CERAMIC, DIP-20 | HC/UH SERIES, 8-BIT DRIVER, INVERTED OUTPUT, PDSO20, PLASTIC, SO-20 | HC/UH SERIES, 8-BIT DRIVER, INVERTED OUTPUT, PDIP20, PLASTIC, DIP-20 | HC/UH SERIES, 8-BIT DRIVER, INVERTED OUTPUT, CQCC20, CERAMIC, LCC-20 | HC/UH SERIES, 8-BIT DRIVER, INVERTED OUTPUT, PDSO20, PLASTIC, SO-20 |
| Parts packaging code | DIP | SOIC | DIP | QLCC | SOIC |
| package instruction | DIP, DIP20,.3 | SOP, | DIP, DIP20,.3 | QCCN, LCC20,.35SQ | SOP, SOP20,.4 |
| Contacts | 20 | 20 | 20 | 20 | 20 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| Other features | BROADSIDE VERSION OF 533 | BROADSIDE VERSION OF 533 | BROADSIDE VERSION OF 533 | BROADSIDE VERSION OF 533 | BROADSIDE VERSION OF 533 |
| series | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH |
| JESD-30 code | R-GDIP-T20 | R-PDSO-G20 | R-PDIP-T20 | S-CQCC-N20 | R-PDSO-G20 |
| length | 24.51 mm | 12.8 mm | 26.075 mm | 8.89 mm | 12.8 mm |
| Load capacitance (CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| Logic integrated circuit type | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| Number of digits | 8 | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 |
| Number of ports | 2 | 2 | 2 | 2 | 2 |
| Number of terminals | 20 | 20 | 20 | 20 | 20 |
| Maximum operating temperature | 125 °C | 85 °C | 85 °C | 125 °C | 85 °C |
| Minimum operating temperature | -55 °C | -40 °C | -40 °C | -55 °C | -40 °C |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Output polarity | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED |
| Package body material | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY |
| encapsulated code | DIP | SOP | DIP | QCCN | SOP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR |
| Package form | IN-LINE | SMALL OUTLINE | IN-LINE | CHIP CARRIER | SMALL OUTLINE |
| propagation delay (tpd) | 35 ns | 29 ns | 29 ns | 35 ns | 29 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 5.08 mm | 2.65 mm | 5.08 mm | 1.905 mm | 2.65 mm |
| Maximum supply voltage (Vsup) | 6 V | 6 V | 6 V | 6 V | 6 V |
| Minimum supply voltage (Vsup) | 2 V | 2 V | 2 V | 2 V | 2 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | YES | NO | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | INDUSTRIAL | INDUSTRIAL | MILITARY | INDUSTRIAL |
| Terminal form | THROUGH-HOLE | GULL WING | THROUGH-HOLE | NO LEAD | GULL WING |
| Terminal pitch | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | QUAD | DUAL |
| width | 7.62 mm | 7.5 mm | 7.62 mm | 8.89 mm | 7.5 mm |
| Is it lead-free? | Contains lead | - | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | - | incompatible | incompatible | incompatible |
| Maker | Texas Instruments | - | Texas Instruments | Texas Instruments | Texas Instruments |
| JESD-609 code | e0 | - | e0 | e0 | e0 |
| Encapsulate equivalent code | DIP20,.3 | - | DIP20,.3 | LCC20,.35SQ | SOP20,.4 |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 2/6 V | - | 2/6 V | 2/6 V | 2/6 V |
| Terminal surface | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Maximum time at peak reflow temperature | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
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