THIN FILM MULTI-TAP RESISTORS
Pad 1
MSMT 117 SERIES
DAT
MECHANICAL DATA
SIZE
SUBSTRATE
SUBSTRATE
RESISTOR
BOND PADS
BACKSIDE SURFACE
0.030" x 0.030" x 0.010" (±0.003")
SILICON
ANTALUM
TANTALUM NITRIDE
25,000 Å MINIMUM GOLD; ALUMINUM OPTIONAL
SUBSTRATE STANDARD
BARE SUBSTRATE STANDARD
SUITABLE
ATT
TTACH
GOLD BACK OPTIONAL. SUITABLE FOR EUTECTIC DIE ATTACH
THIN FILM MULTI-TAP RESIS-
TORS
0.030"
DAT
ELECTRICAL DATA
RESISTANCE
RESISTANCE RANGE
80Ω 160KΩ
80
Ω −
160K
Ω
(THE SEVEN RESISTORS BETWEEN PADS 1 AND 8 ARE EACH 12.5% OF
TOTAL RESISTANCE VALUE;
PADS
THE TOTAL RESISTANCE VALUE; THE FIVE RESISTORS BETWEEN PADS
TOTAL RESISTANCE VALUE.)
8 AND 13 ARE EACH 2.5% OF THE TOTAL RESISTANCE VALUE.)
0.030"
OTHER VALUES AVAILABLE,
PLEASE CONSULT SALES
MSMT 125 SERIES
DAT
MECHANICAL DATA
SIZE
SUBSTRATE
SUBSTRATE
RESISTOR
BOND PADS
BACKSIDE SURFACE
0.034" x 0.034" x 0.010" (±0.003")
SILICON
ANTALUM
TANTALUM NITRIDE
25,000 Å MINIMUM GOLD; ALUMINUM OPTIONAL
SUBSTRATE
BARE SUBSTRATE
TTACH
SUITABLE
ATT
GOLD BACK OPTIONAL. SUITABLE FOR EUTECTIC DIE ATTACH
Pad 1
DAT
ELECTRICAL DATA
RESISTANCE
RESISTANCE RANGE
550Ω 275KΩ
550
Ω
- 275K
Ω
0.034"
1st 10 Resistors =
TOTAL RESISTANCE
TOTAL RESISTANCE
110
2nd 10 Resistors =
TOTAL RESISTANCE
TOTAL RESISTANCE
11
VALUES AV
CONSULT
OTHER VALUES AVAILABLE, PLEASE CONSULT SALES
DAT
117 / 125 COMMON SERIES DATA
0.034"
TOLERANCES
T.C.R.
CURRENT NOISE
RATING
POWER RATING
OPERATING VOLT
OPERATING VOLTAGE
SHORT TERM OVERLOAD
HIGH TEMP EXPOSURE
THERMAL SHOCK
RESISTANCE
MOISTURE RESISTANCE
STABILITY
STABILITY
OPERATING
OPERATING TEMP RANGE
5%, 10% (APPLIES TO INDIVIDUAL RESISTIVE ELEMENTS)
STANDARD
±150ppm/°C STANDARD
-30dB MAX
DERATED LINEARLY
250 mW MAX. (70°C DERATED LINEARLY TO 150°C) P = E
2
/R
100V MAX
RATED
25°
±0.
0.2
5X RATED POWER, 25° C, 5 SEC., ±0.25% MAX.
∆
R/R: ±0.1% MSI TYPICAL
±0.25%
0.03
03%
150°C, 100 HRS., ±0.25% MAX.
∆
R/R: ±0.03% MSI TYPICAL
107F, ±0.25%
MIL-STD 202, METHOD 107F, ±0.25% MAX.
∆
R/R: ±0.1% MSI TYPICAL
±0.
0.5
0.1
MIL-STD 202, METHOD 106, ±0.5% MAX.
∆
R/R: ±0.1% MSI TYPICAL
70°C,
POWER, ±0.5%
1000 HRS., 70°C, 100% POWER, ±0.5% MAX.
∆
R/R: ±0.1% MSI TYPICAL
-55
-55°C TO +125°C
NETWORKS
ARRAYS
& ARRAYS
DESIGNATION
PART NUMBER DESIGNATION
MSMT XXX
SERIES
117
125
X
SUBSTRATE
SUBSTRATE
S = Silicon
X
RESISTIVE
FILM
T = Tantalum
Nitride
XXXXX
OHMIC VALUE
5-Digit Number: 1st
4 Digits Are Significant
With "R" As Decimal
Point When Required.
5th Digit Represents
Number of Zeros.
X
TOLERANCE
J = 5%
K = 10%
X
OPTION
E = Aluminum
Bond Pads
GB = Gold Backside
G = Gold Bond
Pads
MINI-SYSTEMS, INC.
THIN FILM DIVISION
DAVID
ATTLEBORO,
20 DAVID ROAD, N. ATTLEBORO, MA 02760
508-695-0203 FAX: 508-695-6076
DCN TF 113-G-0306
550Ω
Value,
EXAMPLE: MSMT 125-550R0K-G = 125 Series, 550
Ω
Total Res. Value,
Tol.,
±10% Tol., Gold Bond Pads Bare Backside
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