2MX8 DDR SRAM, 0.45ns, PBGA165, 13 X 15 MM, PLASTIC, BGA-165
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Maker | Renesas Electronics Corporation |
Parts packaging code | BGA |
Contacts | 165 |
Reach Compliance Code | compliant |
ECCN code | 3A991.B.2.A |
Maximum access time | 0.35 ns |
Maximum clock frequency (fCLK) | 250 MHz |
I/O type | COMMON |
JESD-30 code | R-PBGA-B165 |
memory density | 16777216 bit |
Memory IC Type | STANDARD SRAM |
memory width | 8 |
Number of terminals | 165 |
word count | 2097152 words |
character code | 2000000 |
Operating mode | SYNCHRONOUS |
organize | 2MX8 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | BGA |
Encapsulate equivalent code | BGA165,11X15,40 |
Package shape | RECTANGULAR |
Package form | GRID ARRAY |
Parallel/Serial | PARALLEL |
power supply | 1.5/1.8,1.8 V |
Certification status | Not Qualified |
Maximum standby current | 0.2 A |
Minimum standby current | 1.7 V |
Maximum slew rate | 0.4 mA |
surface mount | YES |
technology | CMOS |
Terminal form | BALL |
Terminal pitch | 1 mm |
Terminal location | BOTTOM |