MMBZ5252BW datasheet, PDF - EEWORLD Datasheet

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MMBZ5252BW: DescriptionZener Diode, 24V V(Z), 5%, 0.2W, Silicon, Unidirectional, PLASTIC PACKAGE-3; CategoryDiscrete semiconductor diode; File Size84KB，3 Pages; ManufacturerMicro Commercial Components (MCC)

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MMBZ5252BW Overview

Zener Diode, 24V V(Z), 5%, 0.2W, Silicon, Unidirectional, PLASTIC PACKAGE-3

MMBZ5252BW Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Micro Commercial Components (MCC)
package instruction	R-PDSO-G3
Contacts	3
Reach Compliance Code	compliant
ECCN code	EAR99
Configuration	SINGLE
Diode component materials	SILICON
Diode type	ZENER DIODE
JESD-30 code	R-PDSO-G3
JESD-609 code	e0
Number of components	1
Number of terminals	3
Package body material	PLASTIC/EPOXY
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
polarity	UNIDIRECTIONAL
Maximum power dissipation	0.2 W
Certification status	Not Qualified
Nominal reference voltage	24 V
surface mount	YES
technology	ZENER
Terminal surface	TIN LEAD
Terminal form	GULL WING
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
Maximum voltage tolerance	5%
Working test current	5.2 mA

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MCC

TM

Micro Commercial Components

omponents

20736 Marilla Street Chatsworth

!"#

$ % !"#

MMBZ5221BW

THRU

MMBZ5259BW

200 mW

Zener Diode

2.4 to 39 Volts

SOT-323

A

D

Features

•

Wide Voltage Range Available

Small Outline Package For Space Savings

High Temp Soldering: 260°C for 10 Seconds At Terminals

Surface Mount Package

Case Material: Molded Plastic.

Classification Rating 94V-0

UL Flammability

Maximum Ratings

•

Operating

Junction

Temperature: -55°C to +150°C

Storage Temperature: -55°C to +150°C

Maximum Ratings @ 25

o

C Unless Otherwise Specified

Zener Current

I

F

10

mA

Maximum Forward

V

F

0.9

V

Voltage

Power Dissipation

P

d

200

mWatt

(No te s A)

Thermal Resistance R

357

K/W

Juntion to Ambient Air

thJA

(Not e s A)

NOTES:

A. Mounted on FR4 PC board with our suggested solder pad layout .

.

B

C

F

E

G

H

J

K

DIMENSIONS

INCHES

MIN

MAX

.071

.087

.045

.053

.079

.087

.026 Nominal

.047

.055

.012

.016

.000

.004

.035

.039

.004

.010

.012

.016

MM

MIN

MAX

1.80

2.20

1.15

1.35

2.00

2.20

0.65Nominal

1.20

1.40

.30

.40

.000

.100

.90

1.00

.100

.250

.30

.40

DIM

A

B

C

D

E

F

G

H

J

K

NOTE

Suggested Solder

Pad Layout

0.70

0.90

*Pin Configuration - Top View

1.90

0.65

Revision: 1

www.mccsemi.com

1 of 3

2006/07/26

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Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

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