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MC68HC12BE32MFU

Description
IC,MICROCONTROLLER,16-BIT,CPU12 CPU,CMOS,QFP,80PIN,PLASTIC
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size5MB,362 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
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MC68HC12BE32MFU Overview

IC,MICROCONTROLLER,16-BIT,CPU12 CPU,CMOS,QFP,80PIN,PLASTIC

MC68HC12BE32MFU Parametric

Parameter NameAttribute value
MakerNXP
package instructionQFP, QFP80,.7SQ
Reach Compliance Codeunknown
bit size16
CPU seriesCPU12
JESD-30 codeS-PQFP-G80
Number of terminals80
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeQFP
Encapsulate equivalent codeQFP80,.7SQ
Package shapeSQUARE
Package formFLATPACK
power supply5 V
Certification statusNot Qualified
RAM (bytes)1024
rom(word)32768
ROM programmabilityMROM
speed8 MHz
Maximum slew rate70 mA
Nominal supply voltage5 V
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal formGULL WING
Terminal pitch0.635 mm
Terminal locationQUAD
M68HC12B Family
Data Sheet
M68HC12
Microcontrollers
M68HC12B/D
Rev. 8
7/2003
MOTOROLA.COM/SEMICONDUCTORS

MC68HC12BE32MFU Related Products

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Description IC,MICROCONTROLLER,16-BIT,CPU12 CPU,CMOS,QFP,80PIN,PLASTIC IC,MICROCONTROLLER,16-BIT,CPU12 CPU,CMOS,QFP,80PIN,PLASTIC IC,MICROCONTROLLER,16-BIT,CPU12 CPU,CMOS,QFP,80PIN,PLASTIC IC,MICROCONTROLLER,16-BIT,CPU12 CPU,CMOS,QFP,80PIN,PLASTIC IC,MICROCONTROLLER,16-BIT,CPU12 CPU,CMOS,QFP,80PIN,PLASTIC IC,MICROCONTROLLER,16-BIT,CPU12 CPU,CMOS,QFP,80PIN,PLASTIC IC,MICROCONTROLLER,16-BIT,CPU12 CPU,CMOS,QFP,80PIN,PLASTIC IC,MICROCONTROLLER,16-BIT,CPU12 CPU,CMOS,QFP,80PIN,PLASTIC IC,MICROCONTROLLER,16-BIT,CPU12 CPU,CMOS,QFP,80PIN,PLASTIC
Maker NXP NXP NXP NXP NXP NXP NXP NXP NXP
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknown
bit size 16 16 16 16 16 16 16 16 16
CPU series CPU12 CPU12 CPU12 CPU12 CPU12 CPU12 CPU12 CPU12 CPU12
JESD-30 code S-PQFP-G80 S-PQFP-G80 S-PQFP-G80 S-PQFP-G80 S-PQFP-G80 S-PQFP-G80 S-PQFP-G80 S-PQFP-G80 S-PQFP-G80
Number of terminals 80 80 80 80 80 80 80 80 80
Maximum operating temperature 125 °C 105 °C 85 °C 85 °C 105 °C 125 °C 105 °C 125 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code QFP QFP QFP QFP QFP QFP QFP QFP QFP
Encapsulate equivalent code QFP80,.7SQ QFP80,.7SQ QFP80,.7SQ QFP80,.68SQ QFP80,.68SQ QFP80,.68SQ QFP80,.7SQ QFP80,.7SQ QFP80,.7SQ
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form FLATPACK FLATPACK FLATPACK FLATPACK FLATPACK FLATPACK FLATPACK FLATPACK FLATPACK
power supply 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
RAM (bytes) 1024 1024 1024 1024 1024 1024 1024 1024 1024
rom(word) 32768 32768 32768 16384 16384 16384 32768 32768 32768
ROM programmability MROM MROM MROM MROM MROM MROM FLASH FLASH FLASH
speed 8 MHz 8 MHz 8 MHz 8 MHz 8 MHz 8 MHz 8 MHz 8 MHz 8 MHz
Maximum slew rate 70 mA 70 mA 70 mA 70 mA 70 mA 70 mA 70 mA 70 mA 70 mA
Nominal supply voltage 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level AUTOMOTIVE INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL AUTOMOTIVE INDUSTRIAL AUTOMOTIVE INDUSTRIAL
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.635 mm 0.635 mm 0.635 mm 0.635 mm 0.635 mm 0.635 mm 0.635 mm 0.635 mm 0.635 mm
Terminal location QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD
package instruction QFP, QFP80,.7SQ QFP, QFP80,.7SQ QFP, QFP80,.7SQ QFP, QFP80,.68SQ QFP, QFP80,.68SQ QFP, QFP80,.68SQ QFP, QFP80,.7SQ - -

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