|
W29C512AT-90 |
W29C512AP-90 |
W29C512A |
Description |
64 K x 8 CMOS FLASH MEMORY |
64 K x 8 CMOS FLASH MEMORY |
64 K x 8 CMOS FLASH MEMORY |
Is it Rohs certified? |
incompatible |
incompatible |
- |
Parts packaging code |
TSOP1 |
QFJ |
- |
package instruction |
TSOP1-32 |
PLASTIC, LCC-32 |
- |
Contacts |
32 |
32 |
- |
Reach Compliance Code |
_compli |
unknow |
- |
ECCN code |
EAR99 |
EAR99 |
- |
Maximum access time |
90 ns |
90 ns |
- |
command user interface |
NO |
NO |
- |
Data polling |
YES |
YES |
- |
Durability |
1000 Write/Erase Cycles |
1000 Write/Erase Cycles |
- |
JESD-30 code |
R-PDSO-G32 |
R-PQCC-J32 |
- |
JESD-609 code |
e0 |
e0 |
- |
length |
18.4 mm |
13.97 mm |
- |
memory density |
524288 bi |
524288 bi |
- |
Memory IC Type |
FLASH |
FLASH |
- |
memory width |
8 |
8 |
- |
Number of functions |
1 |
1 |
- |
Number of departments/size |
512 |
512 |
- |
Number of terminals |
32 |
32 |
- |
word count |
65536 words |
65536 words |
- |
character code |
64000 |
64000 |
- |
Operating mode |
ASYNCHRONOUS |
ASYNCHRONOUS |
- |
Maximum operating temperature |
70 °C |
70 °C |
- |
organize |
64KX8 |
64KX8 |
- |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
- |
encapsulated code |
TSOP1 |
QCCJ |
- |
Encapsulate equivalent code |
TSSOP32,.8,20 |
LDCC32,.5X.6 |
- |
Package shape |
RECTANGULAR |
RECTANGULAR |
- |
Package form |
SMALL OUTLINE, THIN PROFILE |
CHIP CARRIER |
- |
page size |
128 words |
128 words |
- |
Parallel/Serial |
PARALLEL |
PARALLEL |
- |
Peak Reflow Temperature (Celsius) |
240 |
NOT SPECIFIED |
- |
power supply |
5 V |
5 V |
- |
Programming voltage |
5 V |
5 V |
- |
Certification status |
Not Qualified |
Not Qualified |
- |
Maximum seat height |
1.2 mm |
3.56 mm |
- |
Department size |
128 |
128 |
- |
Maximum standby current |
0.0001 A |
0.0001 A |
- |
Maximum slew rate |
0.05 mA |
0.05 mA |
- |
Maximum supply voltage (Vsup) |
5.5 V |
5.5 V |
- |
Minimum supply voltage (Vsup) |
4.5 V |
4.5 V |
- |
Nominal supply voltage (Vsup) |
5 V |
5 V |
- |
surface mount |
YES |
YES |
- |
technology |
CMOS |
CMOS |
- |
Temperature level |
COMMERCIAL |
COMMERCIAL |
- |
Terminal surface |
Tin/Lead (Sn/Pb) |
TIN LEAD |
- |
Terminal form |
GULL WING |
J BEND |
- |
Terminal pitch |
0.5 mm |
1.27 mm |
- |
Terminal location |
DUAL |
QUAD |
- |
Maximum time at peak reflow temperature |
30 |
NOT SPECIFIED |
- |
switch bit |
YES |
YES |
- |
type |
NOR TYPE |
NOR TYPE |
- |
width |
8 mm |
11.43 mm |
- |
Maximum write cycle time (tWC) |
10 ms |
10 ms |
- |
Base Number Matches |
1 |
1 |
- |