TSI384-133IL datasheet, PDF - EEWORLD Datasheet

TSI384-133IL: DescriptionPCI Bus Controller, CMOS, PBGA256, 17 X 17 MM, GREEN, PLASTIC, BGA-256; CategoryThe embedded processor and controller Microcontrollers and processors; File Size2MB，308 Pages; ManufacturerTundra Semiconductor Corp

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PCI Bus Controller, CMOS, PBGA256, 17 X 17 MM, GREEN, PLASTIC, BGA-256

Parameter Name	Attribute value
Maker	Tundra Semiconductor Corp
package instruction	17 X 17 MM, GREEN, PLASTIC, BGA-256
Reach Compliance Code	unknown
Address bus width	64
Bus compatibility	PCI
maximum clock frequency	133 MHz
Drive interface standards	IEEE 1149.6; IEEE 1149.1
External data bus width	64
JESD-30 code	S-PBGA-B256
length	17 mm
Number of terminals	256
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Package shape	SQUARE
Package form	GRID ARRAY
Certification status	Not Qualified
Maximum seat height	1.8 mm
Maximum supply voltage	1.26 V
Minimum supply voltage	1.14 V
Nominal supply voltage	1.2 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
width	17 mm
uPs/uCs/peripheral integrated circuit type	BUS CONTROLLER, PCI

	TSI384-133IL	TSI384-133ILV
Description	PCI Bus Controller, CMOS, PBGA256, 17 X 17 MM, GREEN, PLASTIC, BGA-256	PCI Bus Controller, CMOS, PBGA256, 17 X 17 MM, PLASTIC, BGA-256
Maker	Tundra Semiconductor Corp	Tundra Semiconductor Corp
package instruction	17 X 17 MM, GREEN, PLASTIC, BGA-256	17 X 17 MM, PLASTIC, BGA-256
Reach Compliance Code	unknown	unknown
Address bus width	64	64
Bus compatibility	PCI	PCI
maximum clock frequency	133 MHz	133 MHz
Drive interface standards	IEEE 1149.6; IEEE 1149.1	IEEE 1149.6; IEEE 1149.1
External data bus width	64	64
JESD-30 code	S-PBGA-B256	S-PBGA-B256
length	17 mm	17 mm
Number of terminals	256	256
Maximum operating temperature	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	BGA	BGA
Package shape	SQUARE	SQUARE
Package form	GRID ARRAY	GRID ARRAY
Certification status	Not Qualified	Not Qualified
Maximum seat height	1.8 mm	1.8 mm
Maximum supply voltage	1.26 V	1.26 V
Minimum supply voltage	1.14 V	1.14 V
Nominal supply voltage	1.2 V	1.2 V
surface mount	YES	YES
technology	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL
Terminal form	BALL	BALL
Terminal pitch	1 mm	1 mm
Terminal location	BOTTOM	BOTTOM
width	17 mm	17 mm
uPs/uCs/peripheral integrated circuit type	BUS CONTROLLER, PCI	BUS CONTROLLER, PCI

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