EDO DRAM Module, 1MX64, 60ns, CMOS, SODIMM-144
Parameter Name | Attribute value |
Maker | Infineon |
Parts packaging code | SODIMM |
package instruction | DIMM, DIMM144,32 |
Contacts | 144 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
access mode | FAST PAGE WITH EDO |
Maximum access time | 60 ns |
Other features | RAS ONLY/CAS BEFORE RAS REFRESH |
I/O type | COMMON |
JESD-30 code | R-XZMA-N144 |
memory density | 67108864 bit |
Memory IC Type | EDO DRAM MODULE |
memory width | 64 |
Number of functions | 1 |
Number of ports | 1 |
Number of terminals | 144 |
word count | 1048576 words |
character code | 1000000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 1MX64 |
Output characteristics | 3-STATE |
Package body material | UNSPECIFIED |
encapsulated code | DIMM |
Encapsulate equivalent code | DIMM144,32 |
Package shape | RECTANGULAR |
Package form | MICROELECTRONIC ASSEMBLY |
power supply | 3.3 V |
Certification status | Not Qualified |
refresh cycle | 1024 |
Maximum seat height | 25.4 mm |
self refresh | NO |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 3 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal form | NO LEAD |
Terminal pitch | 0.8 mm |
Terminal location | ZIG-ZAG |
HYM64V1005GCD-60 | HYM64V8005GCDL-60 | HYM64V4005GCDL-50 | HYM64V8005GCDL-50 | HYM64V2005GCDL-60 | HYM64V8005GCD-60 | HYM64V1005GCDL-50 | HYM64V4005GCDL-60 | HYM64V2005GCDL-50 | HYM64V1005GCDL-60 | |
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Description | EDO DRAM Module, 1MX64, 60ns, CMOS, SODIMM-144 | EDO DRAM Module, 8MX64, 60ns, CMOS, SODIMM-144 | EDO DRAM Module, 4MX64, 50ns, CMOS, SODIMM-144 | EDO DRAM Module, 8MX64, 50ns, CMOS, SODIMM-144 | EDO DRAM Module, 2MX64, 60ns, CMOS, SODIMM-144 | EDO DRAM Module, 8MX64, 60ns, CMOS, SODIMM-144 | EDO DRAM Module, 1MX64, 50ns, CMOS, SODIMM-144 | EDO DRAM Module, 4MX64, 60ns, CMOS, SODIMM-144 | EDO DRAM Module, 2MX64, 50ns, CMOS, SODIMM-144 | EDO DRAM Module, 1MX64, 60ns, CMOS, SODIMM-144 |
Parts packaging code | SODIMM | SODIMM | SODIMM | SODIMM | SODIMM | SODIMM | SODIMM | SODIMM | SODIMM | SODIMM |
package instruction | DIMM, DIMM144,32 | DIMM, DIMM144,32 | DIMM, | DIMM, | DIMM, DIMM144,32 | DIMM, DIMM144,32 | DIMM, | DIMM, DIMM144,32 | DIMM, | DIMM, DIMM144,32 |
Contacts | 144 | 144 | 144 | 144 | 144 | 144 | 144 | 144 | 144 | 144 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknow | unknow | unknow | unknow |
ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
access mode | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO |
Maximum access time | 60 ns | 60 ns | 50 ns | 50 ns | 60 ns | 60 ns | 50 ns | 60 ns | 50 ns | 60 ns |
Other features | RAS ONLY/CAS BEFORE RAS REFRESH | RAS ONLY/CAS BEFORE RAS/SELF REFRESH | RAS ONLY/CAS BEFORE RAS/SELF REFRESH | RAS ONLY/CAS BEFORE RAS/SELF REFRESH | RAS ONLY/CAS BEFORE RAS/SELF REFRESH | RAS ONLY/CAS BEFORE RAS REFRESH | RAS ONLY/CAS BEFORE RAS/SELF REFRESH | RAS ONLY/CAS BEFORE RAS/SELF REFRESH | RAS ONLY/CAS BEFORE RAS/SELF REFRESH | RAS ONLY/CAS BEFORE RAS/SELF REFRESH |
JESD-30 code | R-XZMA-N144 | R-XZMA-N144 | R-XZMA-N144 | R-XZMA-N144 | R-XZMA-N144 | R-XZMA-N144 | R-XZMA-N144 | R-XZMA-N144 | R-XZMA-N144 | R-XZMA-N144 |
memory density | 67108864 bit | 536870912 bit | 268435456 bit | 536870912 bit | 134217728 bit | 536870912 bit | 67108864 bi | 268435456 bi | 134217728 bi | 67108864 bi |
Memory IC Type | EDO DRAM MODULE | EDO DRAM MODULE | EDO DRAM MODULE | EDO DRAM MODULE | EDO DRAM MODULE | EDO DRAM MODULE | EDO DRAM MODULE | EDO DRAM MODULE | EDO DRAM MODULE | EDO DRAM MODULE |
memory width | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of ports | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 144 | 144 | 144 | 144 | 144 | 144 | 144 | 144 | 144 | 144 |
word count | 1048576 words | 8388608 words | 4194304 words | 8388608 words | 2097152 words | 8388608 words | 1048576 words | 4194304 words | 2097152 words | 1048576 words |
character code | 1000000 | 8000000 | 4000000 | 8000000 | 2000000 | 8000000 | 1000000 | 4000000 | 2000000 | 1000000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
organize | 1MX64 | 8MX64 | 4MX64 | 8MX64 | 2MX64 | 8MX64 | 1MX64 | 4MX64 | 2MX64 | 1MX64 |
Package body material | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
encapsulated code | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
self refresh | NO | YES | YES | YES | YES | NO | YES | YES | YES | YES |
Maximum supply voltage (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
Minimum supply voltage (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
surface mount | NO | NO | NO | NO | NO | NO | NO | NO | NO | NO |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal form | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
Terminal location | ZIG-ZAG | ZIG-ZAG | ZIG-ZAG | ZIG-ZAG | ZIG-ZAG | ZIG-ZAG | ZIG-ZAG | ZIG-ZAG | ZIG-ZAG | ZIG-ZAG |
Maker | Infineon | - | - | Infineon | Infineon | Infineon | Infineon | Infineon | Infineon | Infineon |
I/O type | COMMON | COMMON | - | - | COMMON | COMMON | - | COMMON | - | COMMON |
Output characteristics | 3-STATE | 3-STATE | - | - | 3-STATE | 3-STATE | - | 3-STATE | - | 3-STATE |
Encapsulate equivalent code | DIMM144,32 | DIMM144,32 | - | - | DIMM144,32 | DIMM144,32 | - | DIMM144,32 | - | DIMM144,32 |
power supply | 3.3 V | 3.3 V | - | - | 3.3 V | 3.3 V | - | 3.3 V | - | 3.3 V |
refresh cycle | 1024 | 4096 | - | - | 2048 | 4096 | - | 4096 | - | 1024 |
Terminal pitch | 0.8 mm | 0.8 mm | - | - | 0.8 mm | 0.8 mm | - | 0.8 mm | - | 0.8 mm |