Parameter Name | Attribute value |
Brand Name | NXP Semiconduc |
Is it Rohs certified? | conform to |
Parts packaging code | SOIC |
package instruction | SOP, SOP8,.25 |
Contacts | 8 |
Manufacturer packaging code | SOT96-1 |
Reach Compliance Code | compli |
Interface integrated circuit type | INTERFACE CIRCUIT |
JESD-30 code | R-PDSO-G8 |
JESD-609 code | e4 |
length | 4.9 mm |
Humidity sensitivity level | 1 |
Number of functions | 1 |
Number of terminals | 8 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | SOP |
Encapsulate equivalent code | SOP8,.25 |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE |
Peak Reflow Temperature (Celsius) | 260 |
power supply | 3/5 V |
Certification status | Not Qualified |
Maximum seat height | 1.75 mm |
Maximum slew rate | 3.6 mA |
Maximum supply voltage | 5.5 V |
Minimum supply voltage | 2.7 V |
Nominal supply voltage | 3.3 V |
Supply voltage 1-max | 5.5 V |
Mains voltage 1-minute | 2.7 V |
Supply voltage1-Nom | 3.3 V |
surface mount | YES |
Temperature level | INDUSTRIAL |
Terminal surface | NICKEL PALLADIUM GOLD |
Terminal form | GULL WING |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | 30 |
width | 3.9 mm |
Base Number Matches | 1 |