100 mA, 50 V, NPN, Si, SMALL SIGNAL TRANSISTOR
| Parameter Name | Attribute value |
| Brand Name | NXP Semiconduc |
| Is it Rohs certified? | conform to |
| Parts packaging code | SC-70 |
| package instruction | SMALL OUTLINE, R-PDSO-G3 |
| Contacts | 3 |
| Manufacturer packaging code | SOT323 |
| Reach Compliance Code | compli |
| ECCN code | EAR99 |
| Other features | BUILT-IN BIAS RESISTOR RATIO IS 21.37 |
| Maximum collector current (IC) | 0.1 A |
| Collector-emitter maximum voltage | 50 V |
| Configuration | SINGLE WITH BUILT-IN RESISTOR |
| Minimum DC current gain (hFE) | 100 |
| JESD-30 code | R-PDSO-G3 |
| JESD-609 code | e3 |
| Humidity sensitivity level | 1 |
| Number of components | 1 |
| Number of terminals | 3 |
| Maximum operating temperature | 150 °C |
| Package body material | PLASTIC/EPOXY |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE |
| Peak Reflow Temperature (Celsius) | 260 |
| Polarity/channel type | NPN |
| Maximum power dissipation(Abs) | 0.2 W |
| Certification status | Not Qualified |
| surface mount | YES |
| Terminal surface | Tin (Sn) |
| Terminal form | GULL WING |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 40 |
| transistor applications | SWITCHING |
| Transistor component materials | SILICON |
| Base Number Matches | 1 |
| PDTC123JU,115 | PDTC123JM,315 | PDTC123JT,215 | PDTC123JT,235 | |
|---|---|---|---|---|
| Description | 100 mA, 50 V, NPN, Si, SMALL SIGNAL TRANSISTOR | 100 mA, 50 V, NPN, Si, SMALL SIGNAL TRANSISTOR | 100 mA, 50 V, NPN, Si, SMALL SIGNAL TRANSISTOR, TO-236AB | 100 mA, 50 V, NPN, Si, SMALL SIGNAL TRANSISTOR, TO-236AB |
| Brand Name | NXP Semiconduc | NXP Semiconductor | NXP Semiconduc | NXP Semiconduc |
| Is it Rohs certified? | conform to | conform to | conform to | conform to |
| Parts packaging code | SC-70 | DFN | TO-236 | TO-236 |
| package instruction | SMALL OUTLINE, R-PDSO-G3 | 1.0 X 0.6 MM, 0.5 MM HEIGHT, ULTRA SMALL, PLASTIC, SMD, SC-101, 3 PIN | SMALL OUTLINE, R-PDSO-G3 | SMALL OUTLINE, R-PDSO-G3 |
| Contacts | 3 | 3 | 3 | 3 |
| Manufacturer packaging code | SOT323 | SOT883 | SOT23 | SOT23 |
| Reach Compliance Code | compli | compliant | compli | compli |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 |
| Other features | BUILT-IN BIAS RESISTOR RATIO IS 21.37 | BUILT-IN BIAS RESISTOR RATIO IS 21.36 | BUILT-IN BIAS RESISTOR RATIO IS 21.36 | BUILT-IN BIAS RESISTOR RATIO IS 21.36 |
| Maximum collector current (IC) | 0.1 A | 0.1 A | 0.1 A | 0.1 A |
| Collector-emitter maximum voltage | 50 V | 50 V | 50 V | 50 V |
| Configuration | SINGLE WITH BUILT-IN RESISTOR | SINGLE WITH BUILT-IN RESISTOR | SINGLE WITH BUILT-IN RESISTOR | SINGLE WITH BUILT-IN RESISTOR |
| Minimum DC current gain (hFE) | 100 | 100 | 100 | 100 |
| JESD-30 code | R-PDSO-G3 | R-PBCC-N3 | R-PDSO-G3 | R-PDSO-G3 |
| JESD-609 code | e3 | e3 | e3 | e3 |
| Humidity sensitivity level | 1 | 1 | 1 | 1 |
| Number of components | 1 | 1 | 1 | 1 |
| Number of terminals | 3 | 3 | 3 | 3 |
| Maximum operating temperature | 150 °C | 150 °C | 150 °C | 150 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE | CHIP CARRIER | SMALL OUTLINE | SMALL OUTLINE |
| Peak Reflow Temperature (Celsius) | 260 | NOT SPECIFIED | 260 | 260 |
| Polarity/channel type | NPN | NPN | NPN | NPN |
| Maximum power dissipation(Abs) | 0.2 W | 0.25 W | 0.25 W | 0.25 W |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| surface mount | YES | YES | YES | YES |
| Terminal surface | Tin (Sn) | Tin (Sn) | Tin (Sn) | Tin (Sn) |
| Terminal form | GULL WING | NO LEAD | GULL WING | GULL WING |
| Terminal location | DUAL | BOTTOM | DUAL | DUAL |
| Maximum time at peak reflow temperature | 40 | NOT SPECIFIED | 40 | 40 |
| transistor applications | SWITCHING | SWITCHING | SWITCHING | SWITCHING |
| Transistor component materials | SILICON | SILICON | SILICON | SILICON |
| Base Number Matches | 1 | 1 | 1 | 1 |
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