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TJA1020T/N1,112

Description
DATACOM, INTERFACE CIRCUIT, PDSO8
CategoryWireless rf/communication    Telecom circuit   
File Size99KB,24 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
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TJA1020T/N1,112 Overview

DATACOM, INTERFACE CIRCUIT, PDSO8

TJA1020T/N1,112 Parametric

Parameter NameAttribute value
Brand NameNXP Semiconduc
Is it Rohs certified?conform to
Parts packaging codeSOIC
package instructionSOP,
Contacts8
Manufacturer packaging codeSOT96-1
Reach Compliance Codeunknow
JESD-30 codeR-PDSO-G8
JESD-609 codee4
length4.9 mm
Humidity sensitivity level1
Number of functions1
Number of terminals8
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
Maximum seat height1.75 mm
Nominal supply voltage12 V
surface mountYES
Telecom integrated circuit typesINTERFACE CIRCUIT
Terminal surfaceNICKEL PALLADIUM GOLD
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperature30
width3.9 mm
Base Number Matches1
INTEGRATED CIRCUITS
DATA SHEET
TJA1020
LIN transceiver
Product specification
Supersedes data of 2001 Dec 17
2002 Jul 17

TJA1020T/N1,112 Related Products

TJA1020T/N1,112 TJA1020T/VM,518 TJA1020T/S490,118 TJA1020U/N1,027 TJA1020U/V,029 TJA1020U/V,027 TJA1020
Description DATACOM, INTERFACE CIRCUIT, PDSO8 TXRX LIN 2.4 - 20KBAUD 8SOIC TXRX LIN 2.4 - 20KBAUD 8SOIC TXRX LIN 2.4 - 20KBAUD 8SOIC TXRX LIN 2.4 - 20KBAUD 8SOIC TXRX LIN 2.4 - 20KBAUD 8SOIC lin transceiver
Brand Name NXP Semiconduc NXP Semiconduc NXP Semiconduc NXP Semiconduc NXP Semiconduc NXP Semiconduc -
package instruction SOP, SOP, SOP, DIE, DIE, DIE, -
Manufacturer packaging code SOT96-1 SOT96-1 SOT96-1 NAU000 NAU000 NAU000 -
Reach Compliance Code unknow unknow unknow unknow unknow unknow -
JESD-30 code R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 R-XUUC-N13 R-XUUC-N13 R-XUUC-N13 -
Number of functions 1 1 1 1 1 1 -
Number of terminals 8 8 8 13 13 13 -
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY UNSPECIFIED UNSPECIFIED UNSPECIFIED -
encapsulated code SOP SOP SOP DIE DIE DIE -
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR -
Package form SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE UNCASED CHIP UNCASED CHIP UNCASED CHIP -
Nominal supply voltage 12 V 12 V 12 V 12 V 12 V 12 V -
surface mount YES YES YES YES YES YES -
Telecom integrated circuit types INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT -
Terminal form GULL WING GULL WING GULL WING NO LEAD NO LEAD NO LEAD -
Terminal location DUAL DUAL DUAL UPPER UPPER UPPER -
Base Number Matches 1 - 1 1 1 1 -
Source Url Status Check Date - 2013-06-14 00:00:00 2013-06-14 00:00:00 2013-06-14 00:00:00 2013-06-14 00:00:00 2013-06-14 00:00:00 -
Filter level - AEC-Q100 AEC-Q100 AEC-Q100 AEC-Q100 AEC-Q100 -
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