GS832136AGD-250T datasheet, PDF

GS832136AGD-250T: DescriptionCache SRAM, 1MX36, 5.5ns, CMOS, PBGA165, ROHS COMPLIANT, FPBGA-165; Categorystorage storage; File Size489KB，32 Pages; ManufacturerGSI Technology; Websitehttp://www.gsitechnology.com/; Environmental Compliance

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GS832136AGD-250T Overview

Cache SRAM, 1MX36, 5.5ns, CMOS, PBGA165, ROHS COMPLIANT, FPBGA-165

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	GSI Technology
Parts packaging code	BGA
package instruction	LBGA, BGA165,11X15,40
Contacts	165
Reach Compliance Code	compliant
ECCN code	3A991.B.2.B
Maximum access time	5.5 ns
Other features	PIPELINE OR FLOW THROUGH ARCHITECTUREL; ALSO OPERATES AT 3.3 V SUPPLY
Maximum clock frequency (fCLK)	250 MHz
I/O type	COMMON
JESD-30 code	R-PBGA-B165
length	15 mm
memory density	37748736 bit
Memory IC Type	CACHE SRAM
memory width	36
Number of functions	1
Number of terminals	165
word count	1048576 words
character code	1000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature
organize	1MX36
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	LBGA
Encapsulate equivalent code	BGA165,11X15,40
Package shape	RECTANGULAR
Package form	GRID ARRAY, LOW PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	2.5/3.3 V
Certification status	Not Qualified
Maximum seat height	1.4 mm
Maximum standby current	0.03 A
Minimum standby current	2.3 V
Maximum slew rate	0.26 mA
Maximum supply voltage (Vsup)	2.7 V
Minimum supply voltage (Vsup)	2.3 V
Nominal supply voltage (Vsup)	2.5 V
surface mount	YES
technology	CMOS
Temperature level	OTHER
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	13 mm

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