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CXP87400-U01R

Description
Microprocessor Circuit, CMOS, CQFP100, CERAMIC, PIGGY BACK, QFP-100
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size187KB,8 Pages
ManufacturerSONY
Websitehttp://www.sony.co.jp
Environmental Compliance  
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CXP87400-U01R Overview

Microprocessor Circuit, CMOS, CQFP100, CERAMIC, PIGGY BACK, QFP-100

CXP87400-U01R Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerSONY
Parts packaging codeQFP
package instructionAQFP,
Contacts100
Reach Compliance Codeunknown
JESD-30 codeS-CQFP-G100
JESD-609 codee4
length22.3 mm
Number of terminals100
Maximum operating temperature75 °C
Minimum operating temperature-20 °C
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeAQFP
Package shapeSQUARE
Package formFLATPACK, PIGGYBACK
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
Maximum seat height10.44 mm
Maximum supply voltage5.5 V
Minimum supply voltage3 V
Nominal supply voltage5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL EXTENDED
Terminal surfaceGOLD
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationQUAD
Maximum time at peak reflow temperature10
width16.3 mm
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR CIRCUIT

CXP87400-U01R Related Products

CXP87400-U01R CXP87400-U02Q CXP87400-U01Q CXP87400-U02R CXP87400-U03R
Description Microprocessor Circuit, CMOS, CQFP100, CERAMIC, PIGGY BACK, QFP-100 Microprocessor Circuit, CMOS, CQFP100, CERAMIC, PIGGY BACK, QFP-100 Microprocessor Circuit, CMOS, CQFP100, CERAMIC, PIGGY BACK, QFP-100 Microprocessor Circuit, CMOS, CQFP100, CERAMIC, PIGGY BACK, QFP-100 Microprocessor Circuit, CMOS, CQFP100, CERAMIC, PIGGY BACK, QFP-100
Is it lead-free? Lead free Lead free Lead free Lead free Lead free
Is it Rohs certified? conform to conform to conform to conform to conform to
Maker SONY SONY SONY SONY SONY
Parts packaging code QFP QFP QFP QFP QFP
package instruction AQFP, AQFP, AQFP, AQFP, AQFP,
Contacts 100 100 100 100 100
Reach Compliance Code unknown unknown unknown unknown unknown
JESD-30 code S-CQFP-G100 R-CQFP-G100 R-CQFP-G100 S-CQFP-G100 S-CQFP-G100
JESD-609 code e4 e4 e4 e4 e4
length 22.3 mm 22.3 mm 22.3 mm 22.3 mm 22.3 mm
Number of terminals 100 100 100 100 100
Maximum operating temperature 75 °C 75 °C 75 °C 75 °C 75 °C
Minimum operating temperature -20 °C -20 °C -20 °C -20 °C -20 °C
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
encapsulated code AQFP AQFP AQFP AQFP AQFP
Package shape SQUARE RECTANGULAR RECTANGULAR SQUARE SQUARE
Package form FLATPACK, PIGGYBACK FLATPACK, PIGGYBACK FLATPACK, PIGGYBACK FLATPACK, PIGGYBACK FLATPACK, PIGGYBACK
Peak Reflow Temperature (Celsius) 260 260 260 260 260
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 10.44 mm 10.44 mm 10.44 mm 10.44 mm 10.44 mm
Maximum supply voltage 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage 3 V 3 V 3 V 3 V 3 V
Nominal supply voltage 5 V 5 V 5 V 5 V 5 V
surface mount YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL EXTENDED COMMERCIAL EXTENDED COMMERCIAL EXTENDED COMMERCIAL EXTENDED COMMERCIAL EXTENDED
Terminal surface GOLD GOLD GOLD GOLD GOLD
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm
Terminal location QUAD QUAD QUAD QUAD QUAD
Maximum time at peak reflow temperature 10 10 10 10 10
width 16.3 mm 16.3 mm 16.3 mm 16.3 mm 16.3 mm
uPs/uCs/peripheral integrated circuit type MICROPROCESSOR CIRCUIT MICROPROCESSOR CIRCUIT MICROPROCESSOR CIRCUIT MICROPROCESSOR CIRCUIT MICROPROCESSOR CIRCUIT

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