Microprocessor Circuit, CMOS, CQFP100, CERAMIC, PIGGY BACK, QFP-100
Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | SONY |
Parts packaging code | QFP |
package instruction | AQFP, |
Contacts | 100 |
Reach Compliance Code | unknown |
JESD-30 code | S-CQFP-G100 |
JESD-609 code | e4 |
length | 22.3 mm |
Number of terminals | 100 |
Maximum operating temperature | 75 °C |
Minimum operating temperature | -20 °C |
Package body material | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | AQFP |
Package shape | SQUARE |
Package form | FLATPACK, PIGGYBACK |
Peak Reflow Temperature (Celsius) | 260 |
Certification status | Not Qualified |
Maximum seat height | 10.44 mm |
Maximum supply voltage | 5.5 V |
Minimum supply voltage | 3 V |
Nominal supply voltage | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL EXTENDED |
Terminal surface | GOLD |
Terminal form | GULL WING |
Terminal pitch | 0.65 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | 10 |
width | 16.3 mm |
uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR CIRCUIT |
CXP87400-U01R | CXP87400-U02Q | CXP87400-U01Q | CXP87400-U02R | CXP87400-U03R | |
---|---|---|---|---|---|
Description | Microprocessor Circuit, CMOS, CQFP100, CERAMIC, PIGGY BACK, QFP-100 | Microprocessor Circuit, CMOS, CQFP100, CERAMIC, PIGGY BACK, QFP-100 | Microprocessor Circuit, CMOS, CQFP100, CERAMIC, PIGGY BACK, QFP-100 | Microprocessor Circuit, CMOS, CQFP100, CERAMIC, PIGGY BACK, QFP-100 | Microprocessor Circuit, CMOS, CQFP100, CERAMIC, PIGGY BACK, QFP-100 |
Is it lead-free? | Lead free | Lead free | Lead free | Lead free | Lead free |
Is it Rohs certified? | conform to | conform to | conform to | conform to | conform to |
Maker | SONY | SONY | SONY | SONY | SONY |
Parts packaging code | QFP | QFP | QFP | QFP | QFP |
package instruction | AQFP, | AQFP, | AQFP, | AQFP, | AQFP, |
Contacts | 100 | 100 | 100 | 100 | 100 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
JESD-30 code | S-CQFP-G100 | R-CQFP-G100 | R-CQFP-G100 | S-CQFP-G100 | S-CQFP-G100 |
JESD-609 code | e4 | e4 | e4 | e4 | e4 |
length | 22.3 mm | 22.3 mm | 22.3 mm | 22.3 mm | 22.3 mm |
Number of terminals | 100 | 100 | 100 | 100 | 100 |
Maximum operating temperature | 75 °C | 75 °C | 75 °C | 75 °C | 75 °C |
Minimum operating temperature | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C |
Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | AQFP | AQFP | AQFP | AQFP | AQFP |
Package shape | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE |
Package form | FLATPACK, PIGGYBACK | FLATPACK, PIGGYBACK | FLATPACK, PIGGYBACK | FLATPACK, PIGGYBACK | FLATPACK, PIGGYBACK |
Peak Reflow Temperature (Celsius) | 260 | 260 | 260 | 260 | 260 |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 10.44 mm | 10.44 mm | 10.44 mm | 10.44 mm | 10.44 mm |
Maximum supply voltage | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage | 3 V | 3 V | 3 V | 3 V | 3 V |
Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | YES | YES | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED |
Terminal surface | GOLD | GOLD | GOLD | GOLD | GOLD |
Terminal form | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
Terminal pitch | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm |
Terminal location | QUAD | QUAD | QUAD | QUAD | QUAD |
Maximum time at peak reflow temperature | 10 | 10 | 10 | 10 | 10 |
width | 16.3 mm | 16.3 mm | 16.3 mm | 16.3 mm | 16.3 mm |
uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT |