CXP87400-U02R datasheet, PDF - EEWORLD Datasheet

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CXP87400-U02R: DescriptionMicroprocessor Circuit, CMOS, CQFP100, CERAMIC, PIGGY BACK, QFP-100; CategoryThe embedded processor and controller Microcontrollers and processors; File Size187KB，8 Pages; ManufacturerSONY; Websitehttp://www.sony.co.jp; Environmental Compliance

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CXP87400-U02R Overview

Microprocessor Circuit, CMOS, CQFP100, CERAMIC, PIGGY BACK, QFP-100

CXP87400-U02R Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	SONY
Parts packaging code	QFP
package instruction	AQFP,
Contacts	100
Reach Compliance Code	unknown
JESD-30 code	S-CQFP-G100
JESD-609 code	e4
length	22.3 mm
Number of terminals	100
Maximum operating temperature	75 °C
Minimum operating temperature	-20 °C
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	AQFP
Package shape	SQUARE
Package form	FLATPACK, PIGGYBACK
Peak Reflow Temperature (Celsius)	260
Certification status	Not Qualified
Maximum seat height	10.44 mm
Maximum supply voltage	5.5 V
Minimum supply voltage	3 V
Nominal supply voltage	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL EXTENDED
Terminal surface	GOLD
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	10
width	16.3 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR CIRCUIT

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CXP87400-U02R Related Products

	CXP87400-U02R	CXP87400-U02Q	CXP87400-U01Q	CXP87400-U01R	CXP87400-U03R
Description	Microprocessor Circuit, CMOS, CQFP100, CERAMIC, PIGGY BACK, QFP-100	Microprocessor Circuit, CMOS, CQFP100, CERAMIC, PIGGY BACK, QFP-100	Microprocessor Circuit, CMOS, CQFP100, CERAMIC, PIGGY BACK, QFP-100	Microprocessor Circuit, CMOS, CQFP100, CERAMIC, PIGGY BACK, QFP-100	Microprocessor Circuit, CMOS, CQFP100, CERAMIC, PIGGY BACK, QFP-100
Is it lead-free?	Lead free	Lead free	Lead free	Lead free	Lead free
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to
Maker	SONY	SONY	SONY	SONY	SONY
Parts packaging code	QFP	QFP	QFP	QFP	QFP
package instruction	AQFP,	AQFP,	AQFP,	AQFP,	AQFP,
Contacts	100	100	100	100	100
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown
JESD-30 code	S-CQFP-G100	R-CQFP-G100	R-CQFP-G100	S-CQFP-G100	S-CQFP-G100
JESD-609 code	e4	e4	e4	e4	e4
length	22.3 mm	22.3 mm	22.3 mm	22.3 mm	22.3 mm
Number of terminals	100	100	100	100	100
Maximum operating temperature	75 °C	75 °C	75 °C	75 °C	75 °C
Minimum operating temperature	-20 °C	-20 °C	-20 °C	-20 °C	-20 °C
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	AQFP	AQFP	AQFP	AQFP	AQFP
Package shape	SQUARE	RECTANGULAR	RECTANGULAR	SQUARE	SQUARE
Package form	FLATPACK, PIGGYBACK	FLATPACK, PIGGYBACK	FLATPACK, PIGGYBACK	FLATPACK, PIGGYBACK	FLATPACK, PIGGYBACK
Peak Reflow Temperature (Celsius)	260	260	260	260	260
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	10.44 mm	10.44 mm	10.44 mm	10.44 mm	10.44 mm
Maximum supply voltage	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage	3 V	3 V	3 V	3 V	3 V
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL EXTENDED	COMMERCIAL EXTENDED	COMMERCIAL EXTENDED	COMMERCIAL EXTENDED	COMMERCIAL EXTENDED
Terminal surface	GOLD	GOLD	GOLD	GOLD	GOLD
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	0.65 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm
Terminal location	QUAD	QUAD	QUAD	QUAD	QUAD
Maximum time at peak reflow temperature	10	10	10	10	10
width	16.3 mm	16.3 mm	16.3 mm	16.3 mm	16.3 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT

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