ECCM8
Series
• RoHS Compliant (Pb-Free)
• Miniature four pad ceramic
surface mount package
• AT Cut
• Tape and reel available
NOTES
H
L
W
ECCM8
0.7
4.0
2.5
CRYSTAL
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ELECTRICAL SPECIFICATIONS
Nominal Frequency
12MHz, 12.288MHz, 13MHz, 13.56MHz, 14MHz, 14.31818MHz, 14.7456MHz, 15.36MHz,
16MHz, 16.384MHz, 19.44MHz, 20MHz, 24MHz, 24.576MHz, 25MHz, 26MHz, 27MHz, 30MHz,
32MHz, 32.768MHz, 39MHz, 40MHz, 50MHz
Frequency Tolerance / Stability
Over Operating Temperature Range
Operating Temperature Range
Load Capacitance (C
L
)
±50ppm / ±100ppm, ±30ppm / ±50ppm, ±15ppm / ±30ppm, ±15ppm / ±20ppm, or
±10ppm / ±15ppm
0°C to +70°C, -20°C to +70°C, or -40°C to +85°C
10pF Parallel Resonant
12pF Parallel Resonant
16pF Parallel Resonant
Shunt Capacitance
Mode of Operation
Crystal Cut
Aging (at 25°C)
Drive Level
Storage Temperature Range
Insulation Resistance
Spurious Response
Equivalent Series Resistance
5pF Maximum
Fundamental
AT-Cut
±3ppm / year Maximum
100 µWatts Maximum
-40°C to 85°C
500 Megaohms Minimum at 100V
DC
-3dB Minimum; F
0
to F
0
+5000ppm
100 Ohms Maximum from 12.000MHz to 12.999MHz
80 Ohms Maximum from 13.000MHz to 18.999MHz
60 Ohms Maximum from 19.000MHz to 39.999MHz
50 Ohms Maximum from 40.000MHz to 50.000MHz
MANUFACTURER
CATEGORY
SERIES
PACKAGE
CLASS
REV
.
DATE
ECLIPTEK CORP.
CRYSTAL
ECCM8
CERAMIC
CR46
04/11
800-ECLIPTEK www.ecliptek.com for latest revision
Specifications subject to change without notice.
PART NUMBERING GUIDE
ECCM8 A A 16 - 32.000M TR
FREQUENCY TOLERANCE/STABILITY
A=±50ppm at 25°C, ±100ppm over 0°C to 70°C
B=±50ppm at 25°C, ±100ppm over -20°C to 70°C
C=±50ppm at 25°C, ±100ppm over -40°C to 85°C
D=±30ppm at 25°C, ±50ppm over 0°C to 70°C
E=±30ppm at 25°C, ±50ppm over -20°C to 70°C
F=±30ppm at 25°C, ±50ppm over -40°C to 85°C
G=±15ppm at 25°C, ±30ppm over 0°C to 70°C
H=±15ppm at 25°C, ±30ppm over -20°C to 70°C
J=±15ppm at 25°C, ±30ppm over -40°C to 85°C
K=±15ppm at 25°C, ±20ppm over 0°C to 70°C
L=±15ppm at 25°C, ±20ppm over -20°C to 70°C
M=±15ppm at 25°C, ±20ppm over -40°C to 85°C
N=±10ppm at 25°C, ±15ppm over 0°C to 70°C
P=±10ppm at 25°C, ±15ppm over -20°C to 70°C
MECHANICAL DIMENSIONS
ALL DIMENSIONS IN MILLIMETERS
PACKAGING OPTIONS
Blank=Bulk, TR=Tape and Reel
FREQUENCY
LOAD CAPACITANCE
10=10pF Parallel Resonant
12=12pF Parallel Resonant
16=16PF Parallel Resonant
MODE OF OPERATION
A=Fundamental
SUGGESTED SOLDER PAD LAYOUT
ALL DIMENSIONS IN MILLIMETERS
2.50
±0.20
1.00
±0.10 (x4)
0.70
±0.10
2
3
4.00
±0.20
MARKING
ORIENTATION
2.00
±0.10
4
1
0.70 ±0.15
0.90
±0.10 (x4)
TAPE AND REEL DIMENSIONS
ALL DIMENSIONS IN MILLIMETERS
Pad 1: Crystal
Pad 3: Crystal
Pad 2: Cover/Ground
Pad 4: Cover/Ground
Tolerance = +0.2
TAPE
A
12±.3
B
5.5±.1
C
4.75±.1
D
4 ±.1
E
2±.1
REEL
M
1.5 MIN
N
50 MIN
O
20.2 MIN
P
13±.5
Q
40 MIN
QTY/REEL
1,000
F
4±.1
G
2.9±.1
H
1.5±.1
J
4.4±.1
K
.3 ±.05
L
1 ±.1
R
2.5 MIN
S
10 MIN
T
18.4 MAX
U
180 MAX
V
12.4+2-0
ENVIRONMENTAL/MECHANICAL SPECIFICATIONS
PARAMETER
SPECIFICATION
MARKING SPECIFICATIONS
*Compliant to EIA-481A
ESD Susceptibility
Fine Leak Test
Gross Leak Test
Flammability
Mechanical Shock
Moisture Resistance
Moisture Sensitivity
Resistance to Soldering Heat
Resistance to Solvents
Solderability
Temperature Cycling
Vibration
MANUFACTURER
MIL-STD-883, Method 3015, Class 1, HBM: 1500V
MIL-STD-883, Method 1014, Condition A
MIL-STD-883, Method 1014, Condition C
UL94-V0
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 1004
J-STD-020, MSL 1
MIL-STD-202, Method 210, Condition K
MIL-STD-202, Method 215
MIL-STD-883, Method 2003
MIL-STD-883, Method 1010, Condition B
MIL-STD-883, Method 2007, Condition A
CATEGORY
SERIES
Line 1: E XX.X
Frequency in MHz
(3 Digits Maximum + Decimal)
Line 2: XXXXX
Ecliptek Manufacturing Identifier
PACKAGE
CLASS
REV
.
DATE
ECLIPTEK CORP.
CRYSTAL
ECCM8
CERAMIC
CR46
04/11
800-ECLIPTEK www.ecliptek.com for latest revision
Specifications subject to change without notice.
Microchip MCU
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