Standard SRAM, 256KX72, 8.5ns, CMOS, PBGA209
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | GSI Technology |
package instruction | BGA, BGA209,11X19,40 |
Reach Compliance Code | compliant |
ECCN code | 3A991.B.2.B |
Maximum access time | 8.5 ns |
Maximum clock frequency (fCLK) | 166 MHz |
I/O type | COMMON |
JESD-30 code | R-PBGA-B209 |
memory density | 18874368 bit |
Memory IC Type | STANDARD SRAM |
memory width | 72 |
Humidity sensitivity level | 3 |
Number of terminals | 209 |
word count | 262144 words |
character code | 256000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 256KX72 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | BGA |
Encapsulate equivalent code | BGA209,11X19,40 |
Package shape | RECTANGULAR |
Package form | GRID ARRAY |
Parallel/Serial | PARALLEL |
power supply | 2.5/3.3,3.3 V |
Certification status | Not Qualified |
Maximum standby current | 0.02 A |
Minimum standby current | 3.14 V |
Maximum slew rate | 0.334 mA |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal form | BALL |
Terminal pitch | 1 mm |
Terminal location | BOTTOM |