Cache SRAM, 256KX36, 5.5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165
Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Maker | GSI Technology |
Parts packaging code | BGA |
package instruction | TBGA, |
Contacts | 165 |
Reach Compliance Code | compliant |
ECCN code | 3A991.B.2.B |
Maximum access time | 5.5 ns |
Other features | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY |
JESD-30 code | R-PBGA-B165 |
JESD-609 code | e1 |
length | 15 mm |
memory density | 9437184 bit |
Memory IC Type | CACHE SRAM |
memory width | 36 |
Humidity sensitivity level | 3 |
Number of functions | 1 |
Number of terminals | 165 |
word count | 262144 words |
character code | 256000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 256KX36 |
Package body material | PLASTIC/EPOXY |
encapsulated code | TBGA |
Package shape | RECTANGULAR |
Package form | GRID ARRAY, THIN PROFILE |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 260 |
Certification status | Not Qualified |
Maximum seat height | 1.2 mm |
Maximum supply voltage (Vsup) | 2.7 V |
Minimum supply voltage (Vsup) | 2.3 V |
Nominal supply voltage (Vsup) | 2.5 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Silver/Copper (Sn/Ag/Cu) |
Terminal form | BALL |
Terminal pitch | 1 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 13 mm |