PF38F1030W0YTQ2 datasheet, PDF

PF38F1030W0YTQ2: DescriptionMemory Circuit, Flash+PSRAM, 4MX16, CMOS, PBGA88, 8 X 10 MM, 1.20 MM HEIGHT, LEAD FREE, STACK, CSP-88; Categorystorage storage; File Size706KB，54 Pages; ManufacturerMicron Technology; Websitehttp://www.mdtic.com.tw/; Environmental Compliance

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PF38F1030W0YTQ2 Overview

Memory Circuit, Flash+PSRAM, 4MX16, CMOS, PBGA88, 8 X 10 MM, 1.20 MM HEIGHT, LEAD FREE, STACK, CSP-88

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Micron Technology
Parts packaging code	BGA
package instruction	TFBGA, BGA88,8X12,32
Contacts	88
Reach Compliance Code	compliant
Other features	CONTAINS 16 MBIT SRAM, ALSO CONTAINS 64 MBIT FLASH
JESD-30 code	R-PBGA-B88
length	10 mm
memory density	67108864 bit
Memory IC Type	MEMORY CIRCUIT
memory width	16
Mixed memory types	FLASH+PSRAM
Number of functions	1
Number of terminals	88
word count	4194304 words
character code	4000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-25 °C
organize	4MX16
Package body material	PLASTIC/EPOXY
encapsulated code	TFBGA
Encapsulate equivalent code	BGA88,8X12,32
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260
power supply	1.8,3 V
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum standby current	0.000005 A
Maximum slew rate	0.055 mA
Maximum supply voltage (Vsup)	1.95 V
Minimum supply voltage (Vsup)	1.7 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	OTHER
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	30
width	8 mm

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