IC,MICROCONTROLLER,8-BIT,PIC CPU,CMOS,DIP,18PIN,CERAMIC
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Microchip |
Parts packaging code | DIP |
Contacts | 18 |
Reach Compliance Code | unknown |
Has ADC | NO |
Address bus width | |
bit size | 8 |
CPU series | PIC |
maximum clock frequency | 4 MHz |
DMA channel | NO |
External data bus width | |
JESD-30 code | R-XDIP-T18 |
JESD-609 code | e0 |
length | 22.987 mm |
Number of I/O lines | 13 |
Number of terminals | 18 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
PWM channel | NO |
Package body material | CERAMIC |
encapsulated code | DIP |
Encapsulate equivalent code | DIP18,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
power supply | 3.3/5 V |
Certification status | Not Qualified |
RAM (bytes) | 80 |
rom(word) | 1024 |
ROM programmability | UVPROM |
speed | 4 MHz |
Maximum slew rate | 20 mA |
Maximum supply voltage | 5.5 V |
Minimum supply voltage | 4.5 V |
Nominal supply voltage | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
width | 7.62 mm |
uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER, RISC |
PIC16C556A-/JW | PIC16C556A-E/JW | PIC16C556A-I/JW | PIC16C558A-/JW | PIC16C558A-E/JW | PIC16C558A-I/JW | |
---|---|---|---|---|---|---|
Description | IC,MICROCONTROLLER,8-BIT,PIC CPU,CMOS,DIP,18PIN,CERAMIC | IC,MICROCONTROLLER,8-BIT,PIC CPU,CMOS,DIP,18PIN,CERAMIC | IC,MICROCONTROLLER,8-BIT,PIC CPU,CMOS,DIP,18PIN,CERAMIC | IC,MICROCONTROLLER,8-BIT,PIC CPU,CMOS,DIP,18PIN,CERAMIC | IC,MICROCONTROLLER,8-BIT,PIC CPU,CMOS,DIP,18PIN,CERAMIC | IC,MICROCONTROLLER,8-BIT,PIC CPU,CMOS,DIP,18PIN,CERAMIC |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
Maker | Microchip | Microchip | Microchip | Microchip | Microchip | Microchip |
Parts packaging code | DIP | DIP | DIP | DIP | DIP | DIP |
Contacts | 18 | 18 | 18 | 18 | 18 | 18 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
Has ADC | NO | NO | NO | NO | NO | NO |
bit size | 8 | 8 | 8 | 8 | 8 | 8 |
CPU series | PIC | PIC | PIC | PIC | PIC | PIC |
maximum clock frequency | 4 MHz | 4 MHz | 4 MHz | 4 MHz | 4 MHz | 4 MHz |
DMA channel | NO | NO | NO | NO | NO | NO |
JESD-30 code | R-XDIP-T18 | R-XDIP-T18 | R-XDIP-T18 | R-XDIP-T18 | R-XDIP-T18 | R-XDIP-T18 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
length | 22.987 mm | 22.987 mm | 22.987 mm | 22.987 mm | 22.987 mm | 22.987 mm |
Number of I/O lines | 13 | 13 | 13 | 13 | 13 | 13 |
Number of terminals | 18 | 18 | 18 | 18 | 18 | 18 |
Maximum operating temperature | 70 °C | 125 °C | 85 °C | 70 °C | 125 °C | 85 °C |
Minimum operating temperature | - | -40 °C | -40 °C | - | -40 °C | -40 °C |
PWM channel | NO | NO | NO | NO | NO | NO |
Package body material | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
encapsulated code | DIP | DIP | DIP | DIP | DIP | DIP |
Encapsulate equivalent code | DIP18,.3 | DIP18,.3 | DIP18,.3 | DIP18,.3 | DIP18,.3 | DIP18,.3 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
power supply | 3.3/5 V | 3.3/5 V | 3.3/5 V | 3.3/5 V | 3.3/5 V | 3.3/5 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
RAM (bytes) | 80 | 80 | 80 | 128 | 128 | 128 |
rom(word) | 1024 | 1024 | 1024 | 2048 | 2048 | 2048 |
ROM programmability | UVPROM | UVPROM | UVPROM | UVPROM | UVPROM | UVPROM |
speed | 4 MHz | 4 MHz | 4 MHz | 4 MHz | 4 MHz | 4 MHz |
Maximum slew rate | 20 mA | 20 mA | 20 mA | 20 mA | 20 mA | 20 mA |
Maximum supply voltage | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | NO | NO | NO | NO | NO |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | AUTOMOTIVE | INDUSTRIAL | COMMERCIAL | AUTOMOTIVE | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
width | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm |
uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC |