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SMAJ6487DE3

Description
Zener Diode, 3.9V V(Z), 1%, 1.5W, Silicon, Unidirectional, DO-214BA, ROHS COMPLIANT, PLASTIC, SMAJ, 2 PIN
CategoryDiscrete semiconductor    diode   
File Size157KB,2 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Environmental Compliance
Download Datasheet Parametric View All

SMAJ6487DE3 Overview

Zener Diode, 3.9V V(Z), 1%, 1.5W, Silicon, Unidirectional, DO-214BA, ROHS COMPLIANT, PLASTIC, SMAJ, 2 PIN

SMAJ6487DE3 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerMicrosemi
Parts packaging codeDO-214BA
package instructionR-PDSO-C2
Contacts2
Reach Compliance Codeunknown
ECCN codeEAR99
Other featuresHIGH RELIABILITY, METALLURGICALLY BONDED
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeZENER DIODE
JEDEC-95 codeDO-214BA
JESD-30 codeR-PDSO-C2
JESD-609 codee3
Number of components1
Number of terminals2
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
polarityUNIDIRECTIONAL
Maximum power dissipation1.5 W
Certification statusNot Qualified
Nominal reference voltage3.9 V
surface mountYES
technologyZENER
Terminal surfaceMATTE TIN
Terminal formC BEND
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
Maximum voltage tolerance1%
Working test current64 mA
SMAJ4460 thru SMAJ4496, e3
and SMAJ6485 thru SMAJ6491, e3
1.5 Watt Zener Diodes
SCOTTSDALE DIVISION
DESCRIPTION
This 1.5 watt zener series in a low-profile light-weight plastic surface mount
configuration, with stress-relief J-bend contacts, meets or exceeds the electrical
performance of the 1N4460 thru 1N4496 and 1N6485 thru 1N6491. It also provides
double the overall surge performance by using a larger active die element. This
includes ESD protection per IEC61000-4-2, EFT protection per IEC61000-4-4, and
higher surge levels defined herein. The low-flat profile provides easier insertion or
automatic handling compared to other MELF style packages. Its thermally efficient
design lowers junction temperatures and extends operating temperature range
before derating begins. Power derates to zero at 150°C for these plastic packages.
IMPORTANT:
For the most current data, consult
MICROSEMI’s
website:
http://www.microsemi.com
SURFACE MOUNT
ZENER
WWW .
Microsemi
.C
OM
DO-214BA or AC
(SMAJ)
FEATURES
Zener voltages: 3.3 volts to 200 volts
Metallurgically bonded
Reliability data per JESD22-A108, JESD22-A104,
JESD22-A113-B, JESD22-A101-B, and JESD22-A102
Thermally efficient surface mount with J-bends for
stress relief (flat handling surface for easier placement)
Options for screening in accordance with MIL-PRF-
19500/406 for JAN, JANTX, and JANTXV are available
by adding MQ, MX, or MV prefixes respectively to part
numbers. For example, designate a MXSMAJ4460 for a
JANTX screen.
RoHS Compliant devices available by adding “e3” suffix
APPLICATIONS / BENEFITS
For high reliability voltage regulation in low profile
surface mount locations requiring easy
placement and strain relief
Light weight for airborne or satellite applications
Superior surge quality to protect from ESD and
EFT transients per IEC61000-4-2 and -4-4 and
higher surge levels defined herein
MECHANICAL AND PACKAGING
Molded epoxy package meets UL94V-0
Terminals: Tin-lead or RoHS compliant annealed
matte-Tin plated solderable per MIL-STD-750,
method 2026
Body marked with P/N without SMAJ letters
(ie. 4460, 4496, 6485, 4460, etc.)
Polarity is indicated by cathode band
Weight: 0.064 grams (approximate)
Tape & Reel packaging per EIA-481-2 with 12
mm tape and 2500 units per reel (13 inch reel)
MAXIMUM RATINGS
Operating temperature: -55°C to +150°C
Storage temperature: -55°C to +150°C
1.5 watt steady-state maximum power
Thermal resistance, R
θJL
= 15 °C/W
Solder Temperatures: 260ºC for 10 s (maximum)
POWER DERATING – OUTLINE – MOUNTING PAD
Maximum Power Dissipation (Watts)
DIM
DIMENSIONS
MILLIMETERS
INCHES
MIN
MAX
MIN
MAX
.052
.103
1.32
2.62
.160
.180
4.06
4.57
.100
.110
2.54
2.79
.194
.216
4.93
5.49
.078
.115
1.98
2.92
.030
.060
0.76
1.52
--
.005
--
0.13
2.5
2.0
1.5
1.0
0.5
A
B
C
D
E
F
G
SMAJ4460 – SMAJ4496 &
SMAJ6485 – SMAJ6491
DIMENSION A IS WITHIN DO-214BA BUT HIGHER THAN
STANDARD JEDEC OUTLINES..DIMENSION B IS WIDER
THAN BOTH JEDEC OUTLINES FOR LOWER THERMAL
RESISTANCE
25
50
75 100 125 150 175 200
Outline
T
L
, Lead Temperature (ºC) 3/8” from body
Figure 1. Power Derating Curve
Mounting Pad
Copyright
©
2007
6-20-07 REV B
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Page 1

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