IC,BUFFER/DRIVER,SINGLE,6-BIT,STD-TTL,DIP,16PIN,PLASTIC
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Texas Instruments |
package instruction | DIP, DIP16,.3 |
Reach Compliance Code | unknown |
Control type | ENABLE LOW |
JESD-30 code | R-PDIP-T16 |
JESD-609 code | e0 |
Logic integrated circuit type | BUS DRIVER |
MaximumI(ol) | 0.032 A |
Number of digits | 6 |
Number of functions | 1 |
Number of terminals | 16 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
Output characteristics | 3-STATE |
Output polarity | INVERTED |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Encapsulate equivalent code | DIP16,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Maximum supply current (ICC) | 77 mA |
Prop。Delay @ Nom-Sup | 17 ns |
surface mount | NO |
technology | TTL |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
DM74366N/A+ | DM74366J/A+ | DM74366N/B+ | |
---|---|---|---|
Description | IC,BUFFER/DRIVER,SINGLE,6-BIT,STD-TTL,DIP,16PIN,PLASTIC | IC,BUFFER/DRIVER,SINGLE,6-BIT,STD-TTL,DIP,16PIN,CERAMIC | IC,BUFFER/DRIVER,SINGLE,6-BIT,STD-TTL,DIP,16PIN,PLASTIC |
Is it Rohs certified? | incompatible | incompatible | incompatible |
package instruction | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 |
Reach Compliance Code | unknown | unknown | unknown |
Control type | ENABLE LOW | ENABLE LOW | ENABLE LOW |
JESD-30 code | R-PDIP-T16 | R-XDIP-T16 | R-PDIP-T16 |
JESD-609 code | e0 | e0 | e0 |
Logic integrated circuit type | BUS DRIVER | BUS DRIVER | BUS DRIVER |
MaximumI(ol) | 0.032 A | 0.032 A | 0.032 A |
Number of digits | 6 | 6 | 6 |
Number of functions | 1 | 1 | 1 |
Number of terminals | 16 | 16 | 16 |
Maximum operating temperature | 70 °C | 70 °C | 70 °C |
Output characteristics | 3-STATE | 3-STATE | 3-STATE |
Output polarity | INVERTED | INVERTED | INVERTED |
Package body material | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY |
encapsulated code | DIP | DIP | DIP |
Encapsulate equivalent code | DIP16,.3 | DIP16,.3 | DIP16,.3 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | IN-LINE | IN-LINE |
Maximum supply current (ICC) | 77 mA | 77 mA | 77 mA |
Prop。Delay @ Nom-Sup | 17 ns | 17 ns | 17 ns |
surface mount | NO | NO | NO |
technology | TTL | TTL | TTL |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm |
Terminal location | DUAL | DUAL | DUAL |
Base Number Matches | - | 1 | 1 |