MBRS1635 thru MBRS16150
Taiwan Semiconductor
CREAT BY ART
FEATURES
- Low power loss, high efficiency
- Ideal for automated placement
- Guardring for overvoltage protection
- High surge current capability
- Moisture sensitivity level: level 1, per J-STD-020
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
- Halogen-free according to IEC 61249-2-21 definition
Surface Mount Schottky Barrier Rectifiers
MECHANICAL DATA
Case:
TO-263AB (D
2
PAK)
Molding compound, UL flammability classification rating 94V-0
Base P/N with suffix "G" on packing code - halogen-free
Base P/N with prefix "H" on packing code - AEC-Q101 qualified
Terminal:
Matte tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 1A whisker test
with prefix "H" on packing code meet JESD 201 class 2 whisker test
Polarity:
As marked
Weight:
1.37 g (approximately)
TO-263AB (D
2
PAK)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
(T
A
=25℃ unless otherwise noted)
PARAMETER
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
Peak repetitive forward current
(Rated VR, Square wave, 20KHz)
Peak forward surge current, 8.3 ms single half sine-wave
superimposed on rated load
Peak repetitive reverse surge Current (Note 1)
Maximum instantaneous forward voltage (Note 2)
I
F
=16A, T
J
=25℃
I
F
=16A, T
J
=125℃
Maximum reverse current @ rated VR
Typical thermal resistance
Operating junction temperature range
Storage temperature range
Note 1: 2.0μs Pulse Width, f=1.0KHz
Note 2: Pulse Test : 300μs Pulse Width, 1% Duty Cycle
T
J
=25
℃
T
J
=125
℃
SYMBOL
V
RRM
V
RMS
V
DC
I
F(AV)
I
FRM
I
FSM
I
RRM
V
F
1
0.63
0.57
I
R
R
θJC
T
J
T
STG
0.5
15
10
1.5
- 55 to +150
- 55 to +175
0.75
0.65
MBRS MBRS MBRS MBRS MBRS MBRS MBRS
1635
35
24
35
1645
45
31
45
1650
50
35
50
1660
60
42
60
16
32
150
0.5
0.85
0.82
0.3
7.5
0.95
0.92
0.1
5
mA
O
1690 16100 16150
90
63
90
100
70
100
150
105
150
Unit
V
V
V
A
A
A
A
V
C/W
O
O
C
C
Document Number: DS_D1309064
Version: I13
MBRS1635 thru MBRS16150
Taiwan Semiconductor
ORDERING INFORMATION
PART NO.
MBRS16xx
(Note 1)
AEC-Q101
QUALIFIED
Prefix "H"
RN
C0
PACKING CODE GREEN COMPOUND
CODE
Suffix "G"
D
2
PAK
D
2
PAK
800 / 13" Paper reel
50 / Tube
PACKAGE
PACKING
Note 1: "xx" defines voltage from 35V (MBRS1635) to 150V (MBRS16150)
EXAMPLE
PREFERRED P/N
MBRS1660 RN
MBRS1660 RNG
MBRS1660HRN
PART NO.
MBRS1660
MBRS1660
MBRS1660
H
AEC-Q101
QUALIFIED
PACKING CODE
RN
RN
RN
G
Green compound
AEC-Q101 qualified
GREEN COMPOUND
CODE
DESCRIPTION
RATINGS AND CHARACTERISTICS CURVES
(TA=25℃ unless otherwise noted)
FIG. 2 MAXIMUM NON-REPETITIVE FORWARD SURGE
CURRENT
PEAK FORWARD SURGE CURRENT (A)
150
125
100
75
50
25
0
1
10
NUMBER OF CYCLES AT 60 Hz
100
8.3ms Single Half Sine Wave
JEDEC Method
FIG.1 FORWARD CURRENT DERATING CURVE
20
16
12
8
4
0
50
60
70
80
90
100
110
120
130
140
150
CASE TEMPERATURE (
o
C)
RESISTIVE OR
INDUCTIVELOAD
WITH HEATSINK
AVERAGE FORWARD
A
CURRENT (A)
FIG. 3 TYPICAL FORWARD CHARACTERISTICS
100
Pulse Width=300μs
1% Duty Cycle
INSTANTANEOUS FORWARD
A
CURRENT (A)
10
TJ=125℃
1
TJ=25℃
INSTANTANEOUS REVERSE
A
CURRENT (mA)
100
FIG. 4 TYPICAL REVERSE CHARACTERISTICS
MBRS1635-1645
MBRS1650-16150
10
TJ=125℃
1
0.1
TJ=75℃
0.1
MBRS1635-1645
MBRS1650-16150
0.01
TJ=25℃
0.01
0
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9
FORWARD VOLTAGE (V)
1
1.1 1.2
0.001
0
20
40
60
80
100
120
140
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
Document Number: DS_D1309064
Version: I13
MBRS1635 thru MBRS16150
Taiwan Semiconductor
FIG. 5 TYPICAL JUNCTION CAPACITANCE
10000
JUNCTION CAPACITANCE (pF)
A
f=1.0MHz
Vsig=50mVp-p
FIG. 6 TYPICAL TRANSIENT THERMAL IMPEDANCE
100
TRANSIENT THERMAL IMPEDANCE
A
(℃/W)
10
1000
1
MBRS1635-1645
MBRS1650-16150
100
0.1
1
10
100
REVERSE VOLTAGE (V)
0.1
0.01
0.1
1
T-PULSE DURATION(s)
10
100
PACKAGE OUTLINE DIMENSIONS
Unit (mm)
Min
-
14.60
2.41
0.68
2.29
4.44
1.14
1.14
8.25
0.36
2.03
Max
10.5
15.88
2.67
0.94
2.79
4.70
1.40
1.40
9.25
0.53
2.79
Unit (inch)
Min
-
0.575
0.095
0.027
0.090
0.175
0.045
0.045
0.325
0.014
0.080
Max
0.413
0.625
0.105
0.037
0.110
0.185
0.055
0.055
0.364
0.021
0.110
DIM.
A
B
C
D
E
F
G
H
I
J
K
SUGGESTED PAD LAYOUT
Symbol
A
B
C
D
E
F
G
Unit (mm)
10.8
8.3
1.1
3.5
16.9
9.5
2.5
Unit (inch)
0.425
0.327
0.043
0.138
0.665
0.374
0.098
MARKING DIAGRAM
P/N
G
YWW
F
Document Number: DS_D1309064
= Specific Device Code
= Green Compound
= Date Code
= Factory Code
Version: I13
MBRS1635 thru MBRS16150
Taiwan Semiconductor
CREAT BY ART
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
assumes no responsibility or liability for any errors inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied,to
any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or seling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
Document Number: DS_D1309064
Version: I13
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