MAX3274UGE datasheet, PDF - EEWORLD Datasheet

MAX3274UGE: DescriptionSPECIALTY TELECOM CIRCUIT, QCC16, 4 X 4 MM, 0.90 MM HEIGHT, QFN-16; CategoryWireless rf/communication Telecom circuit; File Size1MB，11 Pages; ManufacturerRochester Electronics; Websitehttps://www.rocelec.com/

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MAX3274UGE Overview

SPECIALTY TELECOM CIRCUIT, QCC16, 4 X 4 MM, 0.90 MM HEIGHT, QFN-16

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Rochester Electronics
Parts packaging code	QFN
package instruction	4 X 4 MM, 0.90 MM HEIGHT, QFN-16
Contacts	16
Reach Compliance Code	unknown
JESD-30 code	S-XQCC-N16
JESD-609 code	e0
length	4 mm
Humidity sensitivity level	1
Number of functions	1
Number of terminals	16
Maximum operating temperature	85 °C
Minimum operating temperature
Package body material	UNSPECIFIED
encapsulated code	HVQCCN
Package shape	SQUARE
Package form	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)	240
Certification status	COMMERCIAL
Maximum seat height	1 mm
Nominal supply voltage	3.3 V
surface mount	YES
technology	BIPOLAR
Telecom integrated circuit types	TELECOM CIRCUIT
Temperature level	OTHER
Terminal surface	TIN LEAD
Terminal form	NO LEAD
Terminal pitch	0.65 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	20
width	4 mm

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