L7C187KME25 datasheet, PDF - EEWORLD Datasheet

L7C187KME25: DescriptionStandard SRAM, 64KX1, 25ns, CMOS, CQCC22, 0.290 X 0.490 INCH, CERAMIC, LCC-22; Categorystorage storage; File Size243KB，6 Pages; ManufacturerLOGIC Devices; Websitehttp://www.logicdevices.com/

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L7C187KME25 Overview

Standard SRAM, 64KX1, 25ns, CMOS, CQCC22, 0.290 X 0.490 INCH, CERAMIC, LCC-22

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	LOGIC Devices
Parts packaging code	LCC
package instruction	QCCN, LCC22,.3X.5
Contacts	22
Reach Compliance Code	unknown
ECCN code	3A001.A.2.C
Maximum access time	25 ns
Other features	AUTOMATIC POWER-DOWN
I/O type	SEPARATE
JESD-30 code	R-CQCC-N22
JESD-609 code	e0
length	12.446 mm
memory density	65536 bit
Memory IC Type	STANDARD SRAM
memory width	1
Humidity sensitivity level	3
Number of functions	1
Number of ports	1
Number of terminals	22
word count	65536 words
character code	64000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	64KX1
Output characteristics	3-STATE
Exportable	NO
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QCCN
Encapsulate equivalent code	LCC22,.3X.5
Package shape	RECTANGULAR
Package form	CHIP CARRIER
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	225
power supply	5 V
Certification status	Not Qualified
Filter level	MIL-STD-883 Class B (Modified)
Maximum seat height	3.048 mm
Maximum standby current	0.00025 A
Minimum standby current	2 V
Maximum slew rate	0.06 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.366 mm

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