MCM67M518AFN10 datasheet, PDF - EEWORLD Datasheet

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MCM67M518AFN10: DescriptionCache SRAM, 32KX18, 10ns, BICMOS, PQCC52, PLASTIC, LCC-52; Categorystorage storage; File Size552KB，9 Pages; ManufacturerMotorola ( NXP ); Websitehttps://www.nxp.com

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MCM67M518AFN10 Overview

Cache SRAM, 32KX18, 10ns, BICMOS, PQCC52, PLASTIC, LCC-52

MCM67M518AFN10 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Motorola ( NXP )
package instruction	PLASTIC, LCC-52
Reach Compliance Code	unknown
ECCN code	3A991.B.2.B
Maximum access time	10 ns
Other features	SELF-TIMED WRITE; BURST COUNTER; BYTE WRITE
I/O type	COMMON
JESD-30 code	S-PQCC-J52
JESD-609 code	e0
length	19.1262 mm
memory density	589824 bit
Memory IC Type	CACHE SRAM
memory width	18
Number of functions	1
Number of ports	1
Number of terminals	52
word count	32768 words
character code	32000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	32KX18
Output characteristics	3-STATE
Exportable	YES
Package body material	PLASTIC/EPOXY
encapsulated code	QCCJ
Encapsulate equivalent code	LDCC52,.8SQ
Package shape	SQUARE
Package form	CHIP CARRIER
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum seat height	4.57 mm
Maximum standby current	0.075 A
Minimum standby current	4.75 V
Maximum slew rate	0.265 mA
Maximum supply voltage (Vsup)	5.25 V
Minimum supply voltage (Vsup)	4.75 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	BICMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	J BEND
Terminal pitch	1.27 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	19.1262 mm

MCM67M518AFN10 Related Products

	MCM67M518AFN10	MCM67M518AFN8.5
Description	Cache SRAM, 32KX18, 10ns, BICMOS, PQCC52, PLASTIC, LCC-52	Cache SRAM, 32KX18, 8.5ns, BICMOS, PQCC52, PLASTIC, LCC-52
Is it Rohs certified?	incompatible	incompatible
package instruction	PLASTIC, LCC-52	PLASTIC, LCC-52
Reach Compliance Code	unknown	unknown
ECCN code	3A991.B.2.B	3A991.B.2.B
Maximum access time	10 ns	8.5 ns
Other features	SELF-TIMED WRITE; BURST COUNTER; BYTE WRITE	SELF-TIMED WRITE; BURST COUNTER; BYTE WRITE
I/O type	COMMON	COMMON
JESD-30 code	S-PQCC-J52	S-PQCC-J52
JESD-609 code	e0	e0
length	19.1262 mm	19.1262 mm
memory density	589824 bit	589824 bit
Memory IC Type	CACHE SRAM	CACHE SRAM
memory width	18	18
Number of functions	1	1
Number of ports	1	1
Number of terminals	52	52
word count	32768 words	32768 words
character code	32000	32000
Operating mode	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	70 °C	70 °C
organize	32KX18	32KX18
Output characteristics	3-STATE	3-STATE
Exportable	YES	YES
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	QCCJ	QCCJ
Encapsulate equivalent code	LDCC52,.8SQ	LDCC52,.8SQ
Package shape	SQUARE	SQUARE
Package form	CHIP CARRIER	CHIP CARRIER
Parallel/Serial	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V
Certification status	Not Qualified	Not Qualified
Maximum seat height	4.57 mm	4.57 mm
Maximum standby current	0.075 A	0.075 A
Minimum standby current	4.75 V	4.75 V
Maximum slew rate	0.265 mA	0.29 mA
Maximum supply voltage (Vsup)	5.25 V	5.25 V
Minimum supply voltage (Vsup)	4.75 V	4.75 V
Nominal supply voltage (Vsup)	5 V	5 V
surface mount	YES	YES
technology	BICMOS	BICMOS
Temperature level	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	J BEND	J BEND
Terminal pitch	1.27 mm	1.27 mm
Terminal location	QUAD	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED
width	19.1262 mm	19.1262 mm

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