D Latch, 2-Func, 4-Bit, CMOS, CDFP24
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | RCA |
package instruction | DFP, FL24,.4 |
Reach Compliance Code | unknown |
JESD-30 code | R-XDFP-F24 |
JESD-609 code | e0 |
Logic integrated circuit type | D LATCH |
Number of digits | 4 |
Number of functions | 2 |
Number of terminals | 24 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
Output characteristics | 3-STATE |
Package body material | CERAMIC |
encapsulated code | DFP |
Encapsulate equivalent code | FL24,.4 |
Package shape | RECTANGULAR |
Package form | FLATPACK |
power supply | 5/15 V |
Certification status | Not Qualified |
Filter level | MIL-STD-883 Class B (Modified) |
surface mount | YES |
technology | CMOS |
Temperature level | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | FLAT |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
CD4508BK/3 | CD4508BF/3 | CD4508BF/3A | CD4508BE98 | CD4508BEX98 | CD4508BFX | |
---|---|---|---|---|---|---|
Description | D Latch, 2-Func, 4-Bit, CMOS, CDFP24 | D Latch, 2-Func, 4-Bit, CMOS, CDIP24 | D Latch, 2-Func, 4-Bit, CMOS, CDIP24 | D Latch, 2-Func, 4-Bit, CMOS, PDIP24 | D Latch, 2-Func, 4-Bit, CMOS, PDIP24 | D Latch, 2-Func, 4-Bit, CMOS, CDIP24, |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
package instruction | DFP, FL24,.4 | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
JESD-30 code | R-XDFP-F24 | R-XDIP-T24 | R-XDIP-T24 | R-PDIP-T24 | R-PDIP-T24 | R-XDIP-T24 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
Logic integrated circuit type | D LATCH | D LATCH | D LATCH | D LATCH | D LATCH | D LATCH |
Number of digits | 4 | 4 | 4 | 4 | 4 | 4 |
Number of functions | 2 | 2 | 2 | 2 | 2 | 2 |
Number of terminals | 24 | 24 | 24 | 24 | 24 | 24 |
Maximum operating temperature | 125 °C | 125 °C | 125 °C | 85 °C | 85 °C | 125 °C |
Minimum operating temperature | -55 °C | -55 °C | -55 °C | -40 °C | -40 °C | -55 °C |
Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
Package body material | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC |
encapsulated code | DFP | DIP | DIP | DIP | DIP | DIP |
Encapsulate equivalent code | FL24,.4 | DIP24,.6 | DIP24,.6 | DIP24,.6 | DIP24,.6 | DIP24,.6 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | FLATPACK | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
power supply | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V |
surface mount | YES | NO | NO | NO | NO | NO |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | MILITARY | MILITARY | MILITARY | INDUSTRIAL | INDUSTRIAL | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | FLAT | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
Maker | RCA | - | RCA | RCA | RCA | RCA |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | - |