|
MAX4707EXT+G103 |
MAX4707EXK-T |
MAX4706ELT-T |
MAX4706EXT-T |
MAX4707EXT-T |
MAX4706EXK+T |
Description |
SPST, |
Analog Switch ICs Low-Voltage, 2ohm, SPST, CMOS Analog Switches |
Analog Switch ICs Low-Voltage, 2ohm, SPST, CMOS Analog Switches |
Analog Switch ICs Low-Voltage, 2ohm, SPST, CMOS Analog Switches |
Analog Switch ICs Low-Voltage, 2ohm, SPST, CMOS Analog Switches |
IC SWITCH SPST SC70-5 |
Is it lead-free? |
Lead free |
Contains lead |
Contains lead |
Contains lead |
Contains lead |
Lead free |
Is it Rohs certified? |
conform to |
incompatible |
incompatible |
incompatible |
incompatible |
conform to |
Maker |
Maxim |
Maxim |
Maxim |
Maxim |
Maxim |
Maxim |
package instruction |
, |
TSSOP, TSSOP6,.08 |
1.5 X 1 MM, 0.80 MM HEIGHT, UDFN-6 |
TSSOP, TSSOP6,.08 |
TSSOP, TSSOP6,.08 |
SC-70, 5 PIN |
Reach Compliance Code |
compliant |
not_compliant |
not_compliant |
not_compliant |
not_compliant |
compliant |
Analog Integrated Circuits - Other Types |
SPST |
SPST |
SPST |
SPST |
SPST |
SPST |
Humidity sensitivity level |
1 |
1 |
1 |
1 |
1 |
1 |
Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
240 |
240 |
240 |
240 |
260 |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
20 |
20 |
20 |
20 |
30 |
Parts packaging code |
- |
SOIC |
DFN |
SOIC |
SOIC |
SOIC |
Contacts |
- |
5 |
6 |
6 |
6 |
5 |
JESD-30 code |
- |
R-PDSO-G5 |
R-PDSO-N6 |
R-PDSO-G6 |
R-PDSO-G6 |
R-PDSO-G5 |
JESD-609 code |
- |
e0 |
e0 |
e0 |
e4 |
e3 |
length |
- |
2 mm |
1.5 mm |
2 mm |
2 mm |
2 mm |
normal position |
- |
NO |
NC |
NC |
NO |
NC |
Number of channels |
- |
1 |
1 |
1 |
1 |
1 |
Number of functions |
- |
1 |
1 |
1 |
1 |
1 |
Number of terminals |
- |
5 |
6 |
6 |
6 |
5 |
Nominal off-state isolation |
- |
82 dB |
82 dB |
82 dB |
82 dB |
82 dB |
Maximum on-state resistance (Ron) |
- |
3 Ω |
3 Ω |
3 Ω |
3 Ω |
3 Ω |
Maximum operating temperature |
- |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
Minimum operating temperature |
- |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
Package body material |
- |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
- |
TSSOP |
VSON |
TSSOP |
TSSOP |
TSSOP |
Encapsulate equivalent code |
- |
TSSOP6,.08 |
SOLCC6,.04,20 |
TSSOP6,.08 |
TSSOP6,.08 |
TSSOP5/6,.08 |
Package shape |
- |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
- |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, VERY THIN PROFILE |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
power supply |
- |
3/3.3 V |
3/3.3 V |
3/3.3 V |
3/3.3 V |
3/3.3 V |
Certification status |
- |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Maximum seat height |
- |
1.1 mm |
0.8 mm |
1.1 mm |
1.1 mm |
1.1 mm |
Maximum supply voltage (Vsup) |
- |
3.6 V |
3.6 V |
3.6 V |
3.6 V |
3.6 V |
Minimum supply voltage (Vsup) |
- |
2.7 V |
2.7 V |
2.7 V |
2.7 V |
2.7 V |
Nominal supply voltage (Vsup) |
- |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
surface mount |
- |
YES |
YES |
YES |
YES |
YES |
Maximum disconnect time |
- |
15 ns |
15 ns |
15 ns |
15 ns |
15 ns |
Maximum connection time |
- |
20 ns |
20 ns |
20 ns |
20 ns |
20 ns |
switch |
- |
BREAK-BEFORE-MAKE |
BREAK-BEFORE-MAKE |
BREAK-BEFORE-MAKE |
BREAK-BEFORE-MAKE |
BREAK-BEFORE-MAKE |
technology |
- |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
Temperature level |
- |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
Terminal surface |
- |
Tin/Lead (Sn85Pb15) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn85Pb15) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Matte Tin (Sn) |
Terminal form |
- |
GULL WING |
NO LEAD |
GULL WING |
GULL WING |
GULL WING |
Terminal pitch |
- |
0.65 mm |
0.5 mm |
0.65 mm |
0.65 mm |
0.65 mm |
Terminal location |
- |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
width |
- |
1.25 mm |
1 mm |
1.25 mm |
1.25 mm |
1.25 mm |