|
MAX4707EXK-T |
MAX4706ELT-T |
MAX4706EXT-T |
MAX4707EXT-T |
MAX4706EXK+T |
MAX4707EXT+G103 |
Description |
Analog Switch ICs Low-Voltage, 2ohm, SPST, CMOS Analog Switches |
Analog Switch ICs Low-Voltage, 2ohm, SPST, CMOS Analog Switches |
Analog Switch ICs Low-Voltage, 2ohm, SPST, CMOS Analog Switches |
Analog Switch ICs Low-Voltage, 2ohm, SPST, CMOS Analog Switches |
IC SWITCH SPST SC70-5 |
SPST, |
Is it lead-free? |
Contains lead |
Contains lead |
Contains lead |
Contains lead |
Lead free |
Lead free |
Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
incompatible |
conform to |
conform to |
Maker |
Maxim |
Maxim |
Maxim |
Maxim |
Maxim |
Maxim |
package instruction |
TSSOP, TSSOP6,.08 |
1.5 X 1 MM, 0.80 MM HEIGHT, UDFN-6 |
TSSOP, TSSOP6,.08 |
TSSOP, TSSOP6,.08 |
SC-70, 5 PIN |
, |
Reach Compliance Code |
not_compliant |
not_compliant |
not_compliant |
not_compliant |
compliant |
compliant |
Analog Integrated Circuits - Other Types |
SPST |
SPST |
SPST |
SPST |
SPST |
SPST |
Humidity sensitivity level |
1 |
1 |
1 |
1 |
1 |
1 |
Peak Reflow Temperature (Celsius) |
240 |
240 |
240 |
240 |
260 |
NOT SPECIFIED |
Maximum time at peak reflow temperature |
20 |
20 |
20 |
20 |
30 |
NOT SPECIFIED |
Parts packaging code |
SOIC |
DFN |
SOIC |
SOIC |
SOIC |
- |
Contacts |
5 |
6 |
6 |
6 |
5 |
- |
JESD-30 code |
R-PDSO-G5 |
R-PDSO-N6 |
R-PDSO-G6 |
R-PDSO-G6 |
R-PDSO-G5 |
- |
JESD-609 code |
e0 |
e0 |
e0 |
e4 |
e3 |
- |
length |
2 mm |
1.5 mm |
2 mm |
2 mm |
2 mm |
- |
normal position |
NO |
NC |
NC |
NO |
NC |
- |
Number of channels |
1 |
1 |
1 |
1 |
1 |
- |
Number of functions |
1 |
1 |
1 |
1 |
1 |
- |
Number of terminals |
5 |
6 |
6 |
6 |
5 |
- |
Nominal off-state isolation |
82 dB |
82 dB |
82 dB |
82 dB |
82 dB |
- |
Maximum on-state resistance (Ron) |
3 Ω |
3 Ω |
3 Ω |
3 Ω |
3 Ω |
- |
Maximum operating temperature |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
- |
Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
- |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
- |
encapsulated code |
TSSOP |
VSON |
TSSOP |
TSSOP |
TSSOP |
- |
Encapsulate equivalent code |
TSSOP6,.08 |
SOLCC6,.04,20 |
TSSOP6,.08 |
TSSOP6,.08 |
TSSOP5/6,.08 |
- |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
- |
Package form |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, VERY THIN PROFILE |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
- |
power supply |
3/3.3 V |
3/3.3 V |
3/3.3 V |
3/3.3 V |
3/3.3 V |
- |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
- |
Maximum seat height |
1.1 mm |
0.8 mm |
1.1 mm |
1.1 mm |
1.1 mm |
- |
Maximum supply voltage (Vsup) |
3.6 V |
3.6 V |
3.6 V |
3.6 V |
3.6 V |
- |
Minimum supply voltage (Vsup) |
2.7 V |
2.7 V |
2.7 V |
2.7 V |
2.7 V |
- |
Nominal supply voltage (Vsup) |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
- |
surface mount |
YES |
YES |
YES |
YES |
YES |
- |
Maximum disconnect time |
15 ns |
15 ns |
15 ns |
15 ns |
15 ns |
- |
Maximum connection time |
20 ns |
20 ns |
20 ns |
20 ns |
20 ns |
- |
switch |
BREAK-BEFORE-MAKE |
BREAK-BEFORE-MAKE |
BREAK-BEFORE-MAKE |
BREAK-BEFORE-MAKE |
BREAK-BEFORE-MAKE |
- |
technology |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
- |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
- |
Terminal surface |
Tin/Lead (Sn85Pb15) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn85Pb15) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Matte Tin (Sn) |
- |
Terminal form |
GULL WING |
NO LEAD |
GULL WING |
GULL WING |
GULL WING |
- |
Terminal pitch |
0.65 mm |
0.5 mm |
0.65 mm |
0.65 mm |
0.65 mm |
- |
Terminal location |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
- |
width |
1.25 mm |
1 mm |
1.25 mm |
1.25 mm |
1.25 mm |
- |