HYS 64/72V8300/16220GU
SDRAM-Modules
3.3 V 8M
×
64/72-Bit 1 Bank SDRAM Module
3.3 V 16M
×
64/72-Bit 2 Bank SDRAM Module
168-Pin Unbuffered DIMM Modules
• 168-Pin unbuffered 8-Byte Dual-In-Line
SDRAM Modules for PC main memory
applications
• PC100 and PC133 versions
• 1 bank 8M
×
64, 8M
×
72 and 2 bank
16M
×
64, 16M
×
72 organzation
• Optimized for byte-write non-parity (x64) or
ECC (x72) applications
• JEDEC standard Synchronous DRAMs
(SDRAM)
• Fully PC board layout compatible to INTEL’s
Rev. 1.0 Module Specification
• SDRAM Performance:
-7.5
PC133
f
CK
Clock
• Programmed Latencies:
Product Speed
-7.5
-8
PC133
PC100
CL
3
2
t
RCD
t
RP
3
2
3
2
• Single +3.3 V(±0.3 V) Power Supply
• Programmable CAS Latency, Burst Length,
and Wrap Sequence
(Sequential and Interleave)
• Auto-Refresh (CBR) and Self-Refresh
• Decoupling capacitors mounted on substrate
• All inputs and outputs are LVTTL compatible
• Serial Presence Detect with E
2
PROM
-8
PC100
100
Unit
MHz
133
• Utilizes 8M
×
8 SDRAMs in TSOPII-54
packages with 4096 refresh cycles every
64 ms
• 133.35 mm
×
31.75 mm
×
4,00 mm card size
with gold-contact pads
Frequency
(max.)
t
AC
Clock Access
5.4
6
ns
Time
The HYS 64(72)V8300GU and HYS 64(72)V16220GU are industry-standard 168-pin 8-byte Dual
In-line Memory Modules (DIMMs) which are organized as 8M
×
64, 8M
×
72 in 1 bank and 16M
×
64
and 16M
×
72 in two banks of high-speed memory arrays designed with 64M Synchronous DRAMs
(SDRAMs) for non-parity and ECC applications. The DIMMs use -7.5 speed sorted 8M
×
8 SDRAM
devices in TSOP54 packages to meet the PC133-333 requirements and use -8 components for the
standard PC100-222 applications. Decoupling capacitors are mounted on the PC board. The PC
board design is in accordance with INTEL’s PC SDRAM Rev. 1.0 Module Specification. The DIMMs
have Serial Presence Detect, implemented with a serial E
2
PROM using the two-pin I
2
C protocol.
The first 128 bytes are utilized by the DIMM manufacturer and the second 128 bytes are available
to the end user. All INFINEON 168-pin DIMMs provide a high performance, flexible 8-byte interface
in a 133.35 mm long footprint, with 1.25“ (31.75 mm) height.
Data Book
1
12.99
HYS 64/72V8300/16220GU
SDRAM-Modules
Ordering Information
Type
64 MByte DIMMs
HYS 64V8300GU-7.5-…
HYS 72V8300GU-7.5-…
HYS 64V8300GU-8-…
HYS 72V8300GU-8-…
128 MByte DIMMs
HYS 64V16220GU-7.5-… PC133-333-520 L-DIM-168-30 133 MHz 16M
×
64
2 bank SDRAM module
HYS 72V16220GU-7.5-… PC133-333-520 L-DIM-168-30 133 Mhz 16M
×
72
2 bank SDRAM module
HYS 64V16220GU-8-…
HYS 72V16220GU-8-…
PC100-222-620 L-DIM-168-30 100 MHz 16M
×
64
2 bank SDRAM module
PC100-222-620 L-DIM-168-30 100 Mhz 16M
×
72
2 bank SDRAM module
1.25“
1.25“
1.25“
1.25“
PC133-333-520 L-DIM-168-33 133 Mhz 8M
×
64 1 bank 1.25“
SDRAM module
PC133-333-520 L-DIM-168-33 133 Mhz 8M
×
72 1 bank 1.25“
SDRAM module
PC100-222-620 L-DIM-168-33 100 MHz 8M
×
64 1 bank 1.25“
SDRAM module
PC100-222-620 L-DIM-168-33 100 MHz 8M
×
72 1 bank 1.25“
SDRAM module
Code
Package
Descriptions
Module
Height
Note: All part numbers end with a place code (not shown), designating the die revision. Consult
factory for current revision. Example: HYS 64V8300GU-8-B, indicates that Rev.B dies are
used for SDRAM components.
Data Book
2
12.99