EPSA12BBHN-36.000M TR
Series
RoHS Compliant (Pb-free) 2.5V 4 Pad 5mm x 7mm
Ceramic SMD LVCMOS Programmable Spread
Spectrum Oscillator
Frequency Tolerance/Stability
±50ppm Maximum
Operating Temperature Range
-40°C to +85°C
RoHS
Pb
Packaging Options
Tape & Reel
EPSA12 B B H N -36.000M TR
Nominal Frequency
36.000MHz
Spread Spectrum
-3.00% Down Spread
Output Control Function
Tri-State
ELECTRICAL SPECIFICATIONS
Nominal Frequency
Frequency Tolerance/Stability
Operating Temperature Range
Supply Voltage
Maximum Supply Voltage
Input Current
Output Voltage Logic High (Voh)
Output Voltage Logic Low (Vol)
Rise/Fall Time
Duty Cycle
Load Drive Capability
Output Logic Type
Output Control Function
Tri-State Input Voltage (Vih and Vil)
Tri-State Output Disable Time
Tri-State Output Enable Time
Disable Current
Spread Spectrum
Modulation Frequency
Period Jitter
Start Up Time
Storage Temperature Range
36.000MHz
±50ppm Maximum (Inclusive of all conditions: Frequency Stability over the Operating Temperature Range,
Supply Voltage Change, Output Load Change, First Year Aging at 25°C, Shock, and Vibration.)
-40°C to +85°C
2.5Vdc ±5%
-0.5Vdc to +3.2Vdc
18mA Maximum
90% of Vdd Minimum (IOH=-8mA)
10% of Vdd Maximum (IOL=+8mA)
3nSec Maximum (Measured at 10% to 90% of Waveform)
50% ±5(%) (Measured at 50% of waveform)
15pF Maximum
CMOS
Tri-State (Disabled Output: High Impedance)
70% of Vdd Minimum or No Connection to Enable Output, 30% of Vdd Maximum to Disable Output
100nSec Maximum
100nSec Maximum
20mA Maximum (Unloaded; Pad 1=Ground)
-3.00% Down Spread
30kHz Minimum, 32kHz Typical, 45kHz Maximum
100pSec Maximum (Cycle to Cycle; Spread Spectrum-On)
10mSec Maximum
-55°C to +125°C
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
ESD Susceptibility
Fine Leak Test
Flammability
Gross Leak Test
Mechanical Shock
Moisture Resistance
Moisture Sensitivity
Resistance to Soldering Heat
Resistance to Solvents
Solderability
Temperature Cycling
Vibration
MIL-STD-883, Method 3015, Class 1, HBM: 1500V
MIL-STD-883, Method 1014, Condition A
UL94-V0
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 1004
J-STD-020, MSL 1
MIL-STD-202, Method 210, Condition K
MIL-STD-202, Method 215
MIL-STD-883, Method 2003
MIL-STD-883, Method 1010, Condition B
MIL-STD-883, Method 2007, Condition A
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/12/2011 | Page 1 of 6
EPSA12BBHN-36.000M TR
MECHANICAL DIMENSIONS (all dimensions in millimeters)
PIN
CONNECTION
Tri-State
Case Ground
Output
Supply Voltage
7.00
±0.15
3
5.00
±0.15
MARKING
ORIENTATION
2
1.4 ±0.1
5.08
±0.15
4
2.20
±0.15
1
1.4 ±0.2
3.68
±0.15
1
2
3
4
LINE MARKING
1
2
3
ECLIPTEK
36.000M
SXXXXX
S=Configuration Designator
XXXXX=Ecliptek
Manufacturing Identifier
1.60 ±0.20
Suggested Solder Pad Layout
All Dimensions in Millimeters
2.0 (X4)
2.2 (X4)
2.88
Solder Land
(X4)
1.81
All Tolerances are ±0.1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/12/2011 | Page 2 of 6
EPSA12BBHN-36.000M TR
OUTPUT WAVEFORM & TIMING DIAGRAM
TRI-STATE INPUT
V
IH
V
IL
CLOCK OUTPUT
V
OH
90% of Waveform
50% of Waveform
10% of Waveform
V
OL
OUTPUT DISABLE
(HIGH IMPEDANCE
STATE)
t
PLZ
Fall
Time
Rise
Time
T
W
T
Duty Cycle (%) = T
W
/T x 100
t
PZL
Test Circuit for CMOS Output
Oscilloscope
Frequency
Counter
+
+
Power
Supply
_
+
Voltage
Meter
_
Current
Meter
_
Supply
Voltage
(V
DD
)
Probe
(Note 2)
Output
0.01µF
(Note 1)
0.1µF
(Note 1)
Ground
C
L
(Note 3)
Tri-State or
Power Down
Note 1: An external 0.01µF ceramic bypass capacitor in parallel with a 0.1µF high frequency ceramic bypass
capacitor close (less than 2mm) to the package ground and supply voltage pin is required.
Note 2: A low input capacitance (<12pF), 10X Attentuation Factor, High Impedance (>10Mohms), and
High bandwidth (>300MHz) passive probe is recommended.
Note 3: Capacitance value CL includes sum of all probe and fixture capacitance. See applicable specification sheet
for ‘Load Drive Capability’.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/12/2011 | Page 3 of 6
EPSA12BBHN-36.000M TR
Tape & Reel Dimensions
Quantity Per Reel: 1,000 Units
4.0 ±0.1
2.0 ±0.1
1.5 +0.1/-0.0
0.30 ±0.05
7.5 ±0.1
16.0
+0.3/-0.1
6.75 ±0.10
A0*
8.0 ±0.1
*Compliant to EIA 481A
B0*
K0*
1.5 MIN
DIA 40 MIN
Access Hole at
Slot Location
22.4 MAX
360 MAX
DIA 50 MIN
DIA 20.2 MIN
2.5 MIN Width
10.0 MIN Depth
Tape slot in Core
for Tape Start
16.4 +2/-0
DIA 13.0 ±0.2
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/12/2011 | Page 4 of 6
EPSA12BBHN-36.000M TR
Recommended Solder Reflow Methods
T
P
Critical Zone
T
L
to T
P
Ramp-up
Ramp-down
Temperature (T)
T
L
T
S
Max
T
S
Min
t
S
Preheat
t 25°C to Peak
t
L
t
P
Time (t)
High Temperature Infrared/Convection
T
S
MAX to T
L
(Ramp-up Rate)
Preheat
- Temperature Minimum (T
S
MIN)
- Temperature Typical (T
S
TYP)
- Temperature Maximum (T
S
MAX)
- Time (t
S
MIN)
Ramp-up Rate (T
L
to T
P
)
Time Maintained Above:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
P
)
Target Peak Temperature (T
P
Target)
Time within 5°C of actual peak (t
p
)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
Additional Notes
3°C/second Maximum
150°C
175°C
200°C
60 - 180 Seconds
3°C/second Maximum
217°C
60 - 150 Seconds
260°C Maximum for 10 Seconds Maximum
250°C +0/-5°C
20 - 40 seconds
6°C/second Maximum
8 minutes Maximum
Level 1
Temperatures shown are applied to body of device.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/12/2011 | Page 5 of 6
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