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CD54HCT165H

Description
IC,SHIFT REGISTER,HCT-CMOS,DIE
Categorylogic    logic   
File Size473KB,6 Pages
ManufacturerRenesas Electronics Corporation
Websitehttps://www.renesas.com/
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CD54HCT165H Overview

IC,SHIFT REGISTER,HCT-CMOS,DIE

CD54HCT165H Parametric

Parameter NameAttribute value
MakerRenesas Electronics Corporation
package instruction, DIE OR CHIP
Reach Compliance Codeunknown
Maximum Frequency@Nom-Sup18000000 Hz
Number of digits8
Number of functions1
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Encapsulate equivalent codeDIE OR CHIP
power supply5 V
Certification statusNot Qualified
Nominal supply voltage (Vsup)5 V
technologyCMOS
Temperature levelMILITARY

CD54HCT165H Related Products

CD54HCT165H 5962-01-408-5520 CD54HC165H CD74HC165M96 CD74HCT165M96
Description IC,SHIFT REGISTER,HCT-CMOS,DIE IC,SHIFT REGISTER,HCT-CMOS,DIP,16PIN,CERAMIC CD54HC165H PARALLEL IN SERIAL OUT SHIFT REGISTER PARALLEL IN SERIAL OUT SHIFT REGISTER
Reach Compliance Code unknown not_compliant unknown not_compliant not_compliant
Maximum Frequency@Nom-Sup 18000000 Hz 18000000 Hz 20000000 Hz 20000000 Hz 18000000 Hz
Number of digits 8 8 8 8 8
Number of functions 1 1 1 1 1
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C -55 °C -55 °C
Encapsulate equivalent code DIE OR CHIP DIP16,.3 DIE OR CHIP SOP16,.25 SOP16,.25
power supply 5 V 5 V 2/6 V 2/6 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
technology CMOS CMOS CMOS CMOS CMOS
Temperature level MILITARY MILITARY MILITARY MILITARY MILITARY
Maker Renesas Electronics Corporation Renesas Electronics Corporation - Renesas Electronics Corporation Renesas Electronics Corporation
package instruction , DIE OR CHIP DIP, DIP16,.3 - SOP, SOP16,.25 SOP, SOP16,.25
Nominal supply voltage (Vsup) 5 V 5 V - - 5 V
Is it Rohs certified? - incompatible - incompatible incompatible
JESD-30 code - R-XDIP-T16 - R-PDSO-G16 R-PDSO-G16
Number of terminals - 16 - 16 16
Package body material - CERAMIC - PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code - DIP - SOP SOP
Package shape - RECTANGULAR - RECTANGULAR RECTANGULAR
Package form - IN-LINE - SMALL OUTLINE SMALL OUTLINE
surface mount - NO - YES YES
Terminal form - THROUGH-HOLE - GULL WING GULL WING
Terminal pitch - 2.54 mm - 1.27 mm 1.27 mm
Terminal location - DUAL - DUAL DUAL
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