93LCS66/P datasheet, PDF - EEWORLD Datasheet

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93LCS66/P: Description256 X 16 MICROWIRE BUS SERIAL EEPROM, PDIP8, 0.300 INCH, PLASTIC, DIP-8; Categorystorage storage; File Size125KB，12 Pages; ManufacturerMicrochip; Websitehttps://www.microchip.com

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93LCS66/P Overview

256 X 16 MICROWIRE BUS SERIAL EEPROM, PDIP8, 0.300 INCH, PLASTIC, DIP-8

93LCS66/P Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Microchip
Parts packaging code	DIP
package instruction	0.300 INCH, PLASTIC, DIP-8
Contacts	8
Reach Compliance Code	unknown
ECCN code	EAR99
Other features	100K ERASE/WRITE CYCLES MIN; DATA RETENTION > 40 YEARS
Maximum clock frequency (fCLK)	2 MHz
Data retention time - minimum	200
Durability	1000000 Write/Erase Cycles
JESD-30 code	R-PDIP-T8
JESD-609 code	e0
length	9.46 mm
memory density	4096 bit
Memory IC Type	EEPROM
memory width	16
Number of functions	1
Number of terminals	8
word count	256 words
character code	256
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	256X16
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP8,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	SERIAL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3/5 V
Certification status	Not Qualified
Maximum seat height	4.32 mm
Serial bus type	MICROWIRE
Maximum standby current	0.00003 A
Maximum slew rate	0.003 mA
Maximum supply voltage (Vsup)	6 V
Minimum supply voltage (Vsup)	2.5 V
Nominal supply voltage (Vsup)	3 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.62 mm
Maximum write cycle time (tWC)	10 ms
write protect	HARDWARE/SOFTWARE

93LCS66/P Related Products

	93LCS66/P	93LCS56T/SM	93LCS56T/SL	93LCS56T/SN	93LCS66-I/SM	93LCS56-I/SM	93LCS56T-I/SM
Description	256 X 16 MICROWIRE BUS SERIAL EEPROM, PDIP8, 0.300 INCH, PLASTIC, DIP-8	128 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO8, 0.207 INCH, PLASTIC, SOIC-8	128 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO14, 0.150 INCH, PLASTIC, SOIC-14	128 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SOIC-8	256 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO8, 0.207 INCH, PLASTIC, SOIC-8	128 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO8, 0.207 INCH, PLASTIC, SOIC-8	128 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO8, 0.207 INCH, PLASTIC, SOIC-8
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Parts packaging code	DIP	SOIC	SOIC	SOIC	SOIC	SOIC	SOIC
package instruction	0.300 INCH, PLASTIC, DIP-8	SOP, SOP8,.3	SOP, SOP14,.25	SOP, SOP8,.25	0.207 INCH, PLASTIC, SOIC-8	0.207 INCH, PLASTIC, SOIC-8	SOP, SOP8,.3
Contacts	8	8	14	8	8	8	8
Reach Compliance Code	unknown	not_compliant	not_compliant	not_compliant	unknown	unknown	unknown
Other features	100K ERASE/WRITE CYCLES MIN; DATA RETENTION > 40 YEARS	100K ERASE/WRITE CYCLES MIN; DATA RETENTION > 40 YEARS	100K ERASE/WRITE CYCLES MIN; DATA RETENTION > 40 YEARS	100K ERASE/WRITE CYCLES MIN; DATA RETENTION > 40 YEARS	100K ERASE/WRITE CYCLES MIN; DATA RETENTION > 40 YEARS	100K ERASE/WRITE CYCLES MIN; DATA RETENTION > 40 YEARS	100K ERASE/WRITE CYCLES MIN; DATA RETENTION > 40 YEARS
Maximum clock frequency (fCLK)	2 MHz	2 MHz	2 MHz	2 MHz	2 MHz	2 MHz	2 MHz
Data retention time - minimum	200	200	200	200	200	200	200
Durability	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles
JESD-30 code	R-PDIP-T8	R-PDSO-G8	R-PDSO-G14	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8
JESD-609 code	e0	e0	e0	e0	e0	e0	e0
length	9.46 mm	5.28 mm	8.69 mm	4.9 mm	5.28 mm	5.28 mm	5.28 mm
memory density	4096 bit	2048 bit	2048 bit	2048 bit	4096 bit	2048 bit	2048 bit
Memory IC Type	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM
memory width	16	16	16	16	16	16	16
Number of functions	1	1	1	1	1	1	1
Number of terminals	8	8	14	8	8	8	8
word count	256 words	128 words	128 words	128 words	256 words	128 words	128 words
character code	256	128	128	128	256	128	128
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	85 °C	85 °C	85 °C
organize	256X16	128X16	128X16	128X16	256X16	128X16	128X16
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	SOP	SOP	SOP	SOP	SOP	SOP
Encapsulate equivalent code	DIP8,.3	SOP8,.3	SOP14,.25	SOP8,.25	SOP8,.3	SOP8,.3	SOP8,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE
Parallel/Serial	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	3/5 V	3/5 V	3/5 V	3/5 V	3/5 V	3/5 V	3/5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	4.32 mm	2.03 mm	1.75 mm	1.75 mm	2.03 mm	2.03 mm	2.03 mm
Serial bus type	MICROWIRE	MICROWIRE	MICROWIRE	MICROWIRE	MICROWIRE	MICROWIRE	MICROWIRE
Maximum standby current	0.00003 A	0.00003 A	0.00003 A	0.00003 A	0.00003 A	0.00003 A	0.00003 A
Maximum slew rate	0.003 mA	0.003 mA	0.003 mA	0.003 mA	0.003 mA	0.003 mA	0.003 mA
Maximum supply voltage (Vsup)	6 V	6 V	6 V	6 V	6 V	6 V	6 V
Minimum supply voltage (Vsup)	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V
Nominal supply voltage (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V	3 V
surface mount	NO	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	2.54 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	7.62 mm	5.2 mm	3.9 mm	3.9 mm	5.2 mm	5.2 mm	5.2 mm
Maximum write cycle time (tWC)	10 ms	10 ms	10 ms	10 ms	10 ms	10 ms	10 ms
write protect	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE
Maker	Microchip	Microchip	-	-	-	Microchip	Microchip
ECCN code	EAR99	EAR99	EAR99	EAR99	-	-	-
Base Number Matches	-	1	1	1	1	-	-

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