|
93LCS56-I/SM |
93LCS56T/SM |
93LCS56T/SL |
93LCS56T/SN |
93LCS66-I/SM |
93LCS56T-I/SM |
93LCS66/P |
Description |
128 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO8, 0.207 INCH, PLASTIC, SOIC-8 |
128 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO8, 0.207 INCH, PLASTIC, SOIC-8 |
128 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO14, 0.150 INCH, PLASTIC, SOIC-14 |
128 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SOIC-8 |
256 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO8, 0.207 INCH, PLASTIC, SOIC-8 |
128 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO8, 0.207 INCH, PLASTIC, SOIC-8 |
256 X 16 MICROWIRE BUS SERIAL EEPROM, PDIP8, 0.300 INCH, PLASTIC, DIP-8 |
Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
Parts packaging code |
SOIC |
SOIC |
SOIC |
SOIC |
SOIC |
SOIC |
DIP |
package instruction |
0.207 INCH, PLASTIC, SOIC-8 |
SOP, SOP8,.3 |
SOP, SOP14,.25 |
SOP, SOP8,.25 |
0.207 INCH, PLASTIC, SOIC-8 |
SOP, SOP8,.3 |
0.300 INCH, PLASTIC, DIP-8 |
Contacts |
8 |
8 |
14 |
8 |
8 |
8 |
8 |
Reach Compliance Code |
unknown |
not_compliant |
not_compliant |
not_compliant |
unknown |
unknown |
unknown |
Other features |
100K ERASE/WRITE CYCLES MIN; DATA RETENTION > 40 YEARS |
100K ERASE/WRITE CYCLES MIN; DATA RETENTION > 40 YEARS |
100K ERASE/WRITE CYCLES MIN; DATA RETENTION > 40 YEARS |
100K ERASE/WRITE CYCLES MIN; DATA RETENTION > 40 YEARS |
100K ERASE/WRITE CYCLES MIN; DATA RETENTION > 40 YEARS |
100K ERASE/WRITE CYCLES MIN; DATA RETENTION > 40 YEARS |
100K ERASE/WRITE CYCLES MIN; DATA RETENTION > 40 YEARS |
Maximum clock frequency (fCLK) |
2 MHz |
2 MHz |
2 MHz |
2 MHz |
2 MHz |
2 MHz |
2 MHz |
Data retention time - minimum |
200 |
200 |
200 |
200 |
200 |
200 |
200 |
Durability |
1000000 Write/Erase Cycles |
1000000 Write/Erase Cycles |
1000000 Write/Erase Cycles |
1000000 Write/Erase Cycles |
1000000 Write/Erase Cycles |
1000000 Write/Erase Cycles |
1000000 Write/Erase Cycles |
JESD-30 code |
R-PDSO-G8 |
R-PDSO-G8 |
R-PDSO-G14 |
R-PDSO-G8 |
R-PDSO-G8 |
R-PDSO-G8 |
R-PDIP-T8 |
JESD-609 code |
e0 |
e0 |
e0 |
e0 |
e0 |
e0 |
e0 |
length |
5.28 mm |
5.28 mm |
8.69 mm |
4.9 mm |
5.28 mm |
5.28 mm |
9.46 mm |
memory density |
2048 bit |
2048 bit |
2048 bit |
2048 bit |
4096 bit |
2048 bit |
4096 bit |
Memory IC Type |
EEPROM |
EEPROM |
EEPROM |
EEPROM |
EEPROM |
EEPROM |
EEPROM |
memory width |
16 |
16 |
16 |
16 |
16 |
16 |
16 |
Number of functions |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
Number of terminals |
8 |
8 |
14 |
8 |
8 |
8 |
8 |
word count |
128 words |
128 words |
128 words |
128 words |
256 words |
128 words |
256 words |
character code |
128 |
128 |
128 |
128 |
256 |
128 |
256 |
Operating mode |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
Maximum operating temperature |
85 °C |
70 °C |
70 °C |
70 °C |
85 °C |
85 °C |
70 °C |
organize |
128X16 |
128X16 |
128X16 |
128X16 |
256X16 |
128X16 |
256X16 |
Output characteristics |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
SOP |
SOP |
SOP |
SOP |
SOP |
SOP |
DIP |
Encapsulate equivalent code |
SOP8,.3 |
SOP8,.3 |
SOP14,.25 |
SOP8,.25 |
SOP8,.3 |
SOP8,.3 |
DIP8,.3 |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
SMALL OUTLINE |
SMALL OUTLINE |
SMALL OUTLINE |
SMALL OUTLINE |
SMALL OUTLINE |
SMALL OUTLINE |
IN-LINE |
Parallel/Serial |
SERIAL |
SERIAL |
SERIAL |
SERIAL |
SERIAL |
SERIAL |
SERIAL |
Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
power supply |
3/5 V |
3/5 V |
3/5 V |
3/5 V |
3/5 V |
3/5 V |
3/5 V |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Maximum seat height |
2.03 mm |
2.03 mm |
1.75 mm |
1.75 mm |
2.03 mm |
2.03 mm |
4.32 mm |
Serial bus type |
MICROWIRE |
MICROWIRE |
MICROWIRE |
MICROWIRE |
MICROWIRE |
MICROWIRE |
MICROWIRE |
Maximum standby current |
0.00003 A |
0.00003 A |
0.00003 A |
0.00003 A |
0.00003 A |
0.00003 A |
0.00003 A |
Maximum slew rate |
0.003 mA |
0.003 mA |
0.003 mA |
0.003 mA |
0.003 mA |
0.003 mA |
0.003 mA |
Maximum supply voltage (Vsup) |
6 V |
6 V |
6 V |
6 V |
6 V |
6 V |
6 V |
Minimum supply voltage (Vsup) |
2.5 V |
2.5 V |
2.5 V |
2.5 V |
2.5 V |
2.5 V |
2.5 V |
Nominal supply voltage (Vsup) |
3 V |
3 V |
3 V |
3 V |
3 V |
3 V |
3 V |
surface mount |
YES |
YES |
YES |
YES |
YES |
YES |
NO |
technology |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
Temperature level |
INDUSTRIAL |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
INDUSTRIAL |
INDUSTRIAL |
COMMERCIAL |
Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Terminal form |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
THROUGH-HOLE |
Terminal pitch |
1.27 mm |
1.27 mm |
1.27 mm |
1.27 mm |
1.27 mm |
1.27 mm |
2.54 mm |
Terminal location |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
width |
5.2 mm |
5.2 mm |
3.9 mm |
3.9 mm |
5.2 mm |
5.2 mm |
7.62 mm |
Maximum write cycle time (tWC) |
10 ms |
10 ms |
10 ms |
10 ms |
10 ms |
10 ms |
10 ms |
write protect |
HARDWARE/SOFTWARE |
HARDWARE/SOFTWARE |
HARDWARE/SOFTWARE |
HARDWARE/SOFTWARE |
HARDWARE/SOFTWARE |
HARDWARE/SOFTWARE |
HARDWARE/SOFTWARE |
Maker |
Microchip |
Microchip |
- |
- |
- |
Microchip |
Microchip |
ECCN code |
- |
EAR99 |
EAR99 |
EAR99 |
- |
- |
EAR99 |
Base Number Matches |
- |
1 |
1 |
1 |
1 |
- |
- |