IC 512K X 8 STANDARD SRAM, 85 ns, PDSO32, TSOP2-32, Static RAM
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Toshiba Semiconductor |
Parts packaging code | TSOP2 |
package instruction | SOP, |
Contacts | 32 |
Reach Compliance Code | unknown |
ECCN code | 3A991.B.2.A |
Maximum access time | 85 ns |
JESD-30 code | R-PDSO-G32 |
JESD-609 code | e0 |
memory density | 4194304 bit |
Memory IC Type | STANDARD SRAM |
memory width | 8 |
Number of functions | 1 |
Number of terminals | 32 |
word count | 524288 words |
character code | 512000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 512KX8 |
Package body material | PLASTIC/EPOXY |
encapsulated code | SOP |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE |
Parallel/Serial | PARALLEL |
Certification status | Not Qualified |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 2.7 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | TIN LEAD |
Terminal form | GULL WING |
Terminal location | DUAL |
TC554001AFTR-85 | TC554001AFTR-70 | TC554001AFTR-85L | TC554001AFTR-70L | TC554001AFTR-10L | TC554001AFTR-10 | |
---|---|---|---|---|---|---|
Description | IC 512K X 8 STANDARD SRAM, 85 ns, PDSO32, TSOP2-32, Static RAM | IC 512K X 8 STANDARD SRAM, 70 ns, PDSO32, TSOP2-32, Static RAM | IC 512K X 8 STANDARD SRAM, 85 ns, PDSO32, TSOP2-32, Static RAM | IC 512K X 8 STANDARD SRAM, 70 ns, PDSO32, TSOP2-32, Static RAM | IC 512K X 8 STANDARD SRAM, 100 ns, PDSO32, TSOP2-32, Static RAM | IC 512K X 8 STANDARD SRAM, 100 ns, PDSO32, TSOP2-32, Static RAM |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
Maker | Toshiba Semiconductor | Toshiba Semiconductor | Toshiba Semiconductor | Toshiba Semiconductor | Toshiba Semiconductor | Toshiba Semiconductor |
Parts packaging code | TSOP2 | TSOP2 | TSOP2 | TSOP2 | TSOP2 | TSOP2 |
package instruction | SOP, | SOP, | SOP, | SOP, | SOP, | TSOP2-32 |
Contacts | 32 | 32 | 32 | 32 | 32 | 32 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknow |
ECCN code | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | - |
Maximum access time | 85 ns | 70 ns | - | 70 ns | 100 ns | 100 ns |
JESD-30 code | R-PDSO-G32 | R-PDSO-G32 | - | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 |
JESD-609 code | e0 | e0 | - | e0 | e0 | e0 |
memory density | 4194304 bit | 4194304 bit | - | 4194304 bit | 4194304 bit | 4194304 bi |
Memory IC Type | STANDARD SRAM | STANDARD SRAM | - | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
memory width | 8 | 8 | - | 8 | 8 | 8 |
Number of functions | 1 | 1 | - | 1 | 1 | 1 |
Number of terminals | 32 | 32 | - | 32 | 32 | 32 |
word count | 524288 words | 524288 words | - | 524288 words | 524288 words | 524288 words |
character code | 512000 | 512000 | - | 512000 | 512000 | 512000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C | - | 70 °C | 70 °C | 70 °C |
organize | 512KX8 | 512KX8 | - | 512KX8 | 512KX8 | 512KX8 |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | SOP | SOP | - | SOP | SOP | SOP |
Package shape | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | SMALL OUTLINE | SMALL OUTLINE | - | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
Parallel/Serial | PARALLEL | PARALLEL | - | PARALLEL | PARALLEL | PARALLEL |
Certification status | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage (Vsup) | 2.7 V | 2.7 V | - | 4.5 V | 4.5 V | 4.5 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | - | 5 V | 5 V | 5 V |
surface mount | YES | YES | - | YES | YES | YES |
technology | CMOS | CMOS | - | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | - | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal surface | TIN LEAD | TIN LEAD | - | TIN LEAD | TIN LEAD | TIN LEAD |
Terminal form | GULL WING | GULL WING | - | GULL WING | GULL WING | GULL WING |
Terminal location | DUAL | DUAL | - | DUAL | DUAL | DUAL |