Dual-Port SRAM, 4KX8, 20ns, CMOS, PQFP64, PLASTIC, TQFP-64
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | IDT (Integrated Device Technology) |
Parts packaging code | QFP |
package instruction | PLASTIC, TQFP-64 |
Contacts | 64 |
Reach Compliance Code | not_compliant |
ECCN code | EAR99 |
Maximum access time | 20 ns |
Other features | SEMAPHORE; AUTOMATIC POWER-DOWN; BATTERY BACKUP |
I/O type | COMMON |
JESD-30 code | S-PQFP-G64 |
JESD-609 code | e0 |
length | 14 mm |
memory density | 32768 bit |
Memory IC Type | DUAL-PORT SRAM |
memory width | 8 |
Humidity sensitivity level | 3 |
Number of functions | 1 |
Number of ports | 2 |
Number of terminals | 64 |
word count | 4096 words |
character code | 4000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 4KX8 |
Output characteristics | 3-STATE |
Exportable | YES |
Package body material | PLASTIC/EPOXY |
encapsulated code | LQFP |
Encapsulate equivalent code | QFP64,.66SQ,32 |
Package shape | SQUARE |
Package form | FLATPACK, LOW PROFILE |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 240 |
power supply | 5 V |
Certification status | Not Qualified |
Maximum seat height | 1.6 mm |
Maximum standby current | 0.0045 A |
Minimum standby current | 2 V |
Maximum slew rate | 0.24 mA |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn85Pb15) |
Terminal form | GULL WING |
Terminal pitch | 0.8 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | 20 |
width | 14 mm |