LVC/LCX/Z SERIES, 8-BIT DRIVER, TRUE OUTPUT, CDIP20, CERAMIC, DIP-20
Parameter Name | Attribute value |
Maker | Texas Instruments |
Parts packaging code | DIP |
package instruction | DIP, |
Contacts | 20 |
Reach Compliance Code | unknown |
series | LVC/LCX/Z |
JESD-30 code | R-GDIP-T20 |
length | 24.195 mm |
Load capacitance (CL) | 50 pF |
Logic integrated circuit type | BUS DRIVER |
Number of digits | 8 |
Number of functions | 1 |
Number of ports | 2 |
Number of terminals | 20 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
Output characteristics | 3-STATE |
Output polarity | TRUE |
Package body material | CERAMIC, GLASS-SEALED |
encapsulated code | DIP |
Package shape | RECTANGULAR |
Package form | IN-LINE |
propagation delay (tpd) | 9.5 ns |
Certification status | Not Qualified |
Maximum seat height | 5.08 mm |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 2 V |
Nominal supply voltage (Vsup) | 2.7 V |
surface mount | NO |
technology | CMOS |
Temperature level | MILITARY |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
width | 7.62 mm |
SN54LVC373AJ | SN54LVC373AW | SN54LVC373AFK | |
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Description | LVC/LCX/Z SERIES, 8-BIT DRIVER, TRUE OUTPUT, CDIP20, CERAMIC, DIP-20 | LVC/LCX/Z SERIES, 8-BIT DRIVER, TRUE OUTPUT, CDFP20, CERAMIC, DFP-20 | LVC/LCX/Z SERIES, 8-BIT DRIVER, TRUE OUTPUT, CQCC20, CERAMIC, LCC-20 |
Maker | Texas Instruments | Texas Instruments | Texas Instruments |
Parts packaging code | DIP | DFP | QLCC |
package instruction | DIP, | DFP, | QCCN, |
Contacts | 20 | 20 | 20 |
Reach Compliance Code | unknown | unknown | unknown |
series | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z |
JESD-30 code | R-GDIP-T20 | R-GDFP-F20 | S-CQCC-N20 |
length | 24.195 mm | 13.09 mm | 8.89 mm |
Load capacitance (CL) | 50 pF | 50 pF | 50 pF |
Logic integrated circuit type | BUS DRIVER | BUS DRIVER | BUS DRIVER |
Number of digits | 8 | 8 | 8 |
Number of functions | 1 | 1 | 1 |
Number of ports | 2 | 2 | 2 |
Number of terminals | 20 | 20 | 20 |
Maximum operating temperature | 125 °C | 125 °C | 125 °C |
Minimum operating temperature | -55 °C | -55 °C | -55 °C |
Output characteristics | 3-STATE | 3-STATE | 3-STATE |
Output polarity | TRUE | TRUE | TRUE |
Package body material | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | DIP | DFP | QCCN |
Package shape | RECTANGULAR | RECTANGULAR | SQUARE |
Package form | IN-LINE | FLATPACK | CHIP CARRIER |
propagation delay (tpd) | 9.5 ns | 9.5 ns | 9.5 ns |
Certification status | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 5.08 mm | 2.54 mm | 2.03 mm |
Maximum supply voltage (Vsup) | 3.6 V | 3.6 V | 3.6 V |
Minimum supply voltage (Vsup) | 2 V | 2 V | 2 V |
Nominal supply voltage (Vsup) | 2.7 V | 2.7 V | 2.7 V |
surface mount | NO | YES | YES |
technology | CMOS | CMOS | CMOS |
Temperature level | MILITARY | MILITARY | MILITARY |
Terminal form | THROUGH-HOLE | FLAT | NO LEAD |
Terminal pitch | 2.54 mm | 1.27 mm | 1.27 mm |
Terminal location | DUAL | DUAL | QUAD |
width | 7.62 mm | 6.92 mm | 8.89 mm |