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STRUCTURE
PRODUCT
Silicon Monolithic Integrated Circuit
CMOS-type Series Regulator
NAME
ＢＵＸＸＴＤ３ＷＧ Series
○ PIN DESCRIPTION
PIN No.
1
VREF
5
○ BLOCK DIAGRAM and APPLICATION CIRCUIT
VIN
VIN
1
PIN NAME
VIN
GND
STBY
N.C.
VOUT
DESCRIPTION
INPUT Pin
GROUND Pin
OUTPUT CONTROL Pin (High: ON, Low: OFF)
Cin
GND
2
VOUT
VOUT
2
3
4
5
OCP
Co
NO CONNECT
OUTPUT Pin
TSD
VSTBY
4
STBY
3
STBY
CON
Discharge
N.C.
Cin½½½0.47μF (Ceramic)
Co ½½½0.47μF (Ceramic)
Fig.1 BLOCK DIAGRAM and APPLICATION CIRCUIT
○ ABSOLUTE MAXIMUM RATINGS (Ta=25℃)
PARAMETER
Power Supply Voltage
Power Dissipation
Maximum Junction Temperature
Operating Temperature Range
Storage Temperature Range
Symbol
VMAX
Pd
TjMAX
Topr
Tstg
Limit
-0.3 ½ +6.5
540 (*1)
+125
-40 ½ +85
-55 ½ +125
Unit
V
mW
℃
℃
℃
(*1) Pd deleted at 5.4mW/℃ at temperatures above Ta=25℃, mounted on 70×70×1.6mm glass-epoxy PCB.
○ RECOMMENDED OPERATING RANGE (Not to exceed Pd)
PARAMETER
Power Supply Voltage
Maximum Output Current
Symbol
VIN
IMAX
Limit
1.7½5.5
200
Unit
V
mA
REV. B
2/4
○ OPERATING CONDITIONS
PARAMETER
Input Capacitor
Output Capacitor
Symbol
Cin
Co
MIN.
0.22 (*2)
0.22 (*2)
TYP.
0.47
0.47
MAX.
-
-
Unit
μF
μF
CONDITION
Ceramic capacitor recommended
Ceramic capacitor recommended
(*2) Make sure that the output capacitor value is not kept lower than this specified level across a variety of temperature, DC bias,
changing as time progresses characteristic.
○ ELECTRICAL CHARACTERISTICS
(Ta=25℃, VIN=VOUT+1.0V (*3), STBY=VIN, Cin=0.47μF, Co=0.47μF, unless otherwise noted.)
Limit
MIN.
TYP.
MAX.
PARAMETER
Symbol
Unit
Conditions
Overall Device
VOUT×0.99
Output Voltage
Operating Current
Operating Current (STBY)
Ripple Rejection Ratio
VOUT
VOUT-25mV
VOUT
35
-
70
280
260
240
220
2
10
VOUT×1.01
V
VOUT+25mV
IOUT=10μA, VOUT≧2.5V
IOUT=10μA, VOUT＜2.5V
IOUT=0mA
STBY=0V
VRR=-20dBv, fRR=1kHz, IOUT=10mA
2.5V≦VOUT≦2.6V (VIN=0.98*VOUT, IOUT=200mA)
2.7V≦VOUT≦2.85V (VIN=0.98*VOUT, IOUT=200mA)
2.9V≦VOUT≦3.1V (VIN=0.98*VOUT, IOUT=200mA)
3.2V≦VOUT≦3.4V (VIN=0.98*VOUT, IOUT=200mA)
IIN
ISTBY
RR
-
-
45
-
-
60
1.0
-
540
500
460
420
20
80
μA
μA
dB
mV
mV
mV
mV
mV
mV
Dropout Voltage
VSAT
-
-
Line Regulation
Load Regulation
VDL
VDLO
-
-
VIN=VOUT+1.0V to 5.5V (*4), IOUT=10μA
IOUT=0.01mA to 100mA
Over Current Protection (OCP)
Limit Current
Short Current
ILMAX
ISHORT
220
20
400
70
700
150
mA
mA
Vo=VOUT*0.95
Vo=0V
Standby Block
Discharge Resistor
STBY Pin Pull-down Current
STBY Control Voltage
ON
OFF
RDSC
ISTB
VSTBH
VSTBL
20
0.1
1.2
-0.3
50
0.6
-
-
80
2.0
5.5
0.3
Ω
μA
V
V
VIN=4.0V, STBY=0V, VOUT=4.0V
STBY=1.5V
●This product is not designed for protection against radioactive rays.
(*3) VIN=2.5V for VOUT≦1.5V
(*4) VIN=2.5V to 5.5V for VOUT≦1.5V
○ ELECTRICAL CHARACTERISTICS of each Output Voltage
(Ta=25℃, STBY=VIN, Cin=0.47μF, Co=0.47μF, unless otherwise noted.)
Output Voltage
1.0V, 1.2V
1.5V
1.8V, 1.85V, 1.9V, 2.0V, 2.1V
PARAMETER
Maximum
output current
MIN.
80
200
60
200
200
TYP.
160
-
120
-
-
MAX.
-
-
-
-
-
Unit
Conditions
VIN=1.7V
VIN=2.1V
VIN=1.8V
VIN=2.2V
VIN=VOUT+0.6V
mA
REV. B
3/4
○ POWER DISSIPATION CURVES
○ DEVICE NAME and MARKING
Device Name:
0.8
0.6
0.4
0.2
0.54 W
Conditions :
Mounted on glass epoxy PCB.
Size : 70mm×70mm×1.6mm
XX
10
12
15
18
1J
19
20
BUXXTD3WG
a
Description
Output Voltage
1.0V typ.
1.2V typ.
1.5V typ.
1.8V typ.
1.85V typ.
1.9V typ.
2.0V typ.
2.1V typ.
2.5V typ.
2.6V typ.
2.7V typ.
2.8V typ.
2.85V typ.
2.9V typ.
3.0V typ.
3.1V typ.
3.2V typ.
3.3V typ.
3.4V typ.
Marking
F0
F1
F2
F3
F4
F5
F6
F7
F8
F9
G0
G1
G2
G3
G4
G5
G6
G7
G8
Pd (W)
0
25
50
75
85 100
Ta (℃)
125
a
21
25
26
27
28
2J
29
30
31
32
Fig.2 Pd reduction (example)
○ PACKAGE DIMENSIONS (SSOP5)
33
34
Marking
Lot No
.
Fig.3
Package dimensions (Unit : mm)
REV. B
4/4
○ OPERATION NOTES
1.) Absolute maximum ratings
Use of the IC in excess of absolute maximum ratings (such as the input voltage or operating temperature range) may result in damage to the IC.
Assumptions should not be made regarding the state of the IC (e.g., short mode or open mode) when such damage is suffered. If operational
values are expected to exceed the maximum ratings for the device, consider adding protective circuitry (such as fuses) to eliminate the risk of
damaging the IC.
2.) GND potential
The potential of the GND pin must be the minimum potential in the system in all operating conditions. Never connect a potential lower than
GND to any pin, even if only transiently.
3.) Thermal design
Use a thermal design that allows for a sufficient margin for that package power dissipation rating (Pd) under actual operating conditions.
4.) Inter-pin shorts and mounting errors
Use caution when orienting and positioning the IC for mounting on printed circuit boards. Improper mounting or shorts between pins may result
in damage to the IC.
5.) Operation in strong electromagnetic fields
Strong electromagnetic fields may cause the IC to malfunction. Caution should be exercised in applications where strong electromagnetic
fields may be present.
6.) Common impedance
Wiring traces should be as short and wide as possible to minimize common impedance. Bypass capacitors should be use to keep ripple to a
minimum.
7.) Voltage of STBY pin
To enable standby mode for all channels, set the STBY pin to 0.3 V or less, and for normal operation, to 1.2 V or more. Setting STBY to a
voltage between 0.3 V and 1.2 V may cause malfunction and should be avoided. Keep transition time between high and low (or vice versa) to a
minimum.
Additionally, if STBY is shorted to VIN, the IC will switch to standby mode and disable the output discharge circuit, causing a temporary voltage
to remain on the output pin.
If the IC is switched on again while this voltage is present, overshoot may occur on the output. Therefore, in
applications where these pins are shorted, the output should always be completely discharged before turning the IC on.
8.) Over-current protection circuit (OCP)
This IC features an integrated over-current and short-protection circuitry on the output to prevent destruction of the IC when the output is
shorted. The OCP circuitry is designed only to protect the IC from irregular conditions (such as motor output shorts) and is not designed to be
used as an active security device for the application. Therefore, applications should not be designed under the assumption that this circuitry
will engage.
9.) Thermal shutdown circuit (TSD)
This IC also features a thermal shutdown circuit that is designed to turn the output off when the junction temperature of the IC exceeds. This
feature is intended to protect the IC only in the event of thermal overload and is not designed to guarantee operation or act as an active
security device for the application. Therefore, applications should not be designed under the assumption that this circuitry will engage.
10.) Input/output capacitor
Capacitors must be connected between the input/output pins and GND for stable operation,
and should be physically mounted as close to the IC pins as possible (refer to figure 4). The
input capacitor helps to counteract increases in power supply impedance, and increases
stability in applications with long or winding power supply traces. The output capacitance
value is directly related to the overall stability and transient response of the regulator, and
should be set to the largest possible value for the application to increase these
characteristics. During design, keep in mind that in general, ceramic capacitors have a wide
range of tolerances, temperature coefficients and DC bias characteristics, and that their
capacitance values tend to decrease over time. Confirm these details before choosing
appropriate capacitors for your application..
(Please refer the technical note, regarding ceramic capacitor of recommendation.)
ESR [Ω]
ESR [Ω]
Cout=0.47μF, Cin=0.47μF, Temp=+25℃
100
Unstable region
10
1
Stable region
0.1
0.01
0
50
100
IOUT
[mA]
IOUT
[mA]
150
200
Fig.4 Stable region (example)
REV. B
Notice
Notes
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The content specified herein is for the purpose of introducing ROHM's products (hereinafter
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which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
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The technical information specified herein is intended only to show the typical functions of and
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