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MT46V4M16TG-8

Description
DDR DRAM, 4MX16, 0.8ns, CMOS, PDSO66, 0.400 INCH, 0.65 MM PITCH, PLASTIC, TSOP-66
Categorystorage    storage   
File Size4MB,66 Pages
ManufacturerMicron Technology
Websitehttp://www.mdtic.com.tw/
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MT46V4M16TG-8 Overview

DDR DRAM, 4MX16, 0.8ns, CMOS, PDSO66, 0.400 INCH, 0.65 MM PITCH, PLASTIC, TSOP-66

MT46V4M16TG-8 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMicron Technology
Parts packaging codeTSOP
package instruction0.400 INCH, 0.65 MM PITCH, PLASTIC, TSOP-66
Contacts66
Reach Compliance Codeunknown
ECCN codeEAR99
access modeFOUR BANK PAGE BURST
Maximum access time0.8 ns
Maximum clock frequency (fCLK)125 MHz
I/O typeCOMMON
interleaved burst length2,4,8
JESD-30 codeR-PDSO-G66
JESD-609 codee0
length22.22 mm
memory density67108864 bit
Memory IC TypeDDR DRAM
memory width16
Number of functions1
Number of ports1
Number of terminals66
word count4194304 words
character code4000000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize4MX16
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeTSOP2
Encapsulate equivalent codeTSSOP66,.46
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply2.5 V
Certification statusNot Qualified
refresh cycle4096
Maximum seat height1.2 mm
Continuous burst length2,4,8
Maximum standby current0.005 A
Maximum slew rate0.155 mA
Maximum supply voltage (Vsup)2.7 V
Minimum supply voltage (Vsup)2.3 V
Nominal supply voltage (Vsup)2.5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width10.16 mm

MT46V4M16TG-8 Related Products

MT46V4M16TG-8 MT46V4M16TG-7 MT46V4M16TG-75L MT46V4M16TG-7L MT46V4M16TG-8L
Description DDR DRAM, 4MX16, 0.8ns, CMOS, PDSO66, 0.400 INCH, 0.65 MM PITCH, PLASTIC, TSOP-66 DDR DRAM, 4MX16, 0.75ns, CMOS, PDSO66, 0.400 INCH, 0.65 MM PITCH, PLASTIC, TSOP-66 DDR DRAM, 4MX16, 0.75ns, CMOS, PDSO66, 0.400 INCH, 0.65 MM PITCH, PLASTIC, TSOP-66 DDR DRAM, 4MX16, 0.75ns, CMOS, PDSO66, 0.400 INCH, 0.65 MM PITCH, PLASTIC, TSOP-66 DDR DRAM, 4MX16, 0.8ns, CMOS, PDSO66, 0.400 INCH, 0.65 MM PITCH, PLASTIC, TSOP-66
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible
Maker Micron Technology Micron Technology Micron Technology Micron Technology Micron Technology
Parts packaging code TSOP TSOP TSOP TSOP TSOP
package instruction 0.400 INCH, 0.65 MM PITCH, PLASTIC, TSOP-66 0.400 INCH, 0.65 MM PITCH, PLASTIC, TSOP-66 0.400 INCH, 0.65 MM PITCH, PLASTIC, TSOP-66 0.400 INCH, 0.65 MM PITCH, PLASTIC, TSOP-66 0.400 INCH, 0.65 MM PITCH, PLASTIC, TSOP-66
Contacts 66 66 66 66 66
Reach Compliance Code unknown unknown unknown unknown unknown
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99
access mode FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST
Maximum access time 0.8 ns 0.75 ns 0.75 ns 0.75 ns 0.8 ns
Maximum clock frequency (fCLK) 125 MHz 143 MHz 133 MHz 143 MHz 125 MHz
I/O type COMMON COMMON COMMON COMMON COMMON
interleaved burst length 2,4,8 2,4,8 2,4,8 2,4,8 2,4,8
JESD-30 code R-PDSO-G66 R-PDSO-G66 R-PDSO-G66 R-PDSO-G66 R-PDSO-G66
JESD-609 code e0 e0 e0 e0 e0
length 22.22 mm 22.22 mm 22.22 mm 22.22 mm 22.22 mm
memory density 67108864 bit 67108864 bit 67108864 bit 67108864 bit 67108864 bit
Memory IC Type DDR DRAM DDR DRAM DDR DRAM DDR DRAM DDR DRAM
memory width 16 16 16 16 16
Number of functions 1 1 1 1 1
Number of ports 1 1 1 1 1
Number of terminals 66 66 66 66 66
word count 4194304 words 4194304 words 4194304 words 4194304 words 4194304 words
character code 4000000 4000000 4000000 4000000 4000000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C
organize 4MX16 4MX16 4MX16 4MX16 4MX16
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSOP2 TSOP2 TSOP2 TSOP2 TSOP2
Encapsulate equivalent code TSSOP66,.46 TSSOP66,.46 TSSOP66,.46 TSSOP66,.46 TSSOP66,.46
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
refresh cycle 4096 4096 4096 4096 4096
Maximum seat height 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm
Continuous burst length 2,4,8 2,4,8 2,4,8 2,4,8 2,4,8
Maximum standby current 0.005 A 0.005 A 0.005 A 0.005 A 0.005 A
Maximum slew rate 0.155 mA 0.17 mA 0.165 mA 0.17 mA 0.155 mA
Maximum supply voltage (Vsup) 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
Minimum supply voltage (Vsup) 2.3 V 2.3 V 2.3 V 2.3 V 2.3 V
Nominal supply voltage (Vsup) 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V
surface mount YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm
Terminal location DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 10.16 mm 10.16 mm 10.16 mm 10.16 mm 10.16 mm
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