Microprocessor Circuit, CMOS, PDIP8, PLASTIC, DIP-8
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Catalyst |
| Parts packaging code | DIP |
| package instruction | DIP, |
| Contacts | 8 |
| Reach Compliance Code | unknown |
| JESD-30 code | R-PDIP-T8 |
| JESD-609 code | e0 |
| length | 9.27 mm |
| Number of terminals | 8 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | 240 |
| Certification status | Not Qualified |
| Maximum seat height | 4.57 mm |
| Maximum supply voltage | 6 V |
| Minimum supply voltage | 2.7 V |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 30 |
| width | 7.62 mm |
| uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR CIRCUIT |
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