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MC10H302LDS

Description
IC,PARITY GENERATOR/CHECKER,DIP,16PIN,CERAMIC
Categorylogic    logic   
File Size539KB,7 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
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MC10H302LDS Overview

IC,PARITY GENERATOR/CHECKER,DIP,16PIN,CERAMIC

MC10H302LDS Parametric

Parameter NameAttribute value
MakerNXP
package instructionDIP, DIP16,.3
Reach Compliance Codeunknown
JESD-30 codeR-XDIP-T16
Logic integrated circuit typePARITY GENERATOR/CHECKER
Number of terminals16
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP16,.3
Package shapeRECTANGULAR
Package formIN-LINE
Certification statusNot Qualified
surface mountNO
Temperature levelCOMMERCIAL
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL

MC10H302LDS Related Products

MC10H302LDS MC10H302FN MC10H302PD MC10H302LD MC10H302L MC10H302P
Description IC,PARITY GENERATOR/CHECKER,DIP,16PIN,CERAMIC IC,PARITY GENERATOR/CHECKER,LDCC,20PIN,PLASTIC IC,PARITY GENERATOR/CHECKER,DIP,16PIN,PLASTIC IC,PARITY GENERATOR/CHECKER,DIP,16PIN,CERAMIC IC,PARITY GENERATOR/CHECKER,DIP,16PIN,CERAMIC IC,PARITY GENERATOR/CHECKER,DIP,16PIN,PLASTIC
Maker NXP NXP NXP NXP NXP NXP
package instruction DIP, DIP16,.3 QCCJ, LDCC20,.4SQ DIP, DIP16,.3 DIP, DIP16,.3 DIP, DIP16,.3 DIP, DIP16,.3
Reach Compliance Code unknown unknown unknown unknown unknown unknown
JESD-30 code R-XDIP-T16 S-PQCC-J20 R-PDIP-T16 R-XDIP-T16 R-XDIP-T16 R-PDIP-T16
Logic integrated circuit type PARITY GENERATOR/CHECKER PARITY GENERATOR/CHECKER PARITY GENERATOR/CHECKER PARITY GENERATOR/CHECKER PARITY GENERATOR/CHECKER PARITY GENERATOR/CHECKER
Number of terminals 16 20 16 16 16 16
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
Package body material CERAMIC PLASTIC/EPOXY PLASTIC/EPOXY CERAMIC CERAMIC PLASTIC/EPOXY
encapsulated code DIP QCCJ DIP DIP DIP DIP
Encapsulate equivalent code DIP16,.3 LDCC20,.4SQ DIP16,.3 DIP16,.3 DIP16,.3 DIP16,.3
Package shape RECTANGULAR SQUARE RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE CHIP CARRIER IN-LINE IN-LINE IN-LINE IN-LINE
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
surface mount NO YES NO NO NO NO
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form THROUGH-HOLE J BEND THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 1.27 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location DUAL QUAD DUAL DUAL DUAL DUAL
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