IC,PARITY GENERATOR/CHECKER,DIP,16PIN,CERAMIC
Parameter Name | Attribute value |
Maker | NXP |
package instruction | DIP, DIP16,.3 |
Reach Compliance Code | unknown |
JESD-30 code | R-XDIP-T16 |
Logic integrated circuit type | PARITY GENERATOR/CHECKER |
Number of terminals | 16 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
Package body material | CERAMIC |
encapsulated code | DIP |
Encapsulate equivalent code | DIP16,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Certification status | Not Qualified |
surface mount | NO |
Temperature level | COMMERCIAL |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
MC10H302LDS | MC10H302FN | MC10H302PD | MC10H302LD | MC10H302L | MC10H302P | |
---|---|---|---|---|---|---|
Description | IC,PARITY GENERATOR/CHECKER,DIP,16PIN,CERAMIC | IC,PARITY GENERATOR/CHECKER,LDCC,20PIN,PLASTIC | IC,PARITY GENERATOR/CHECKER,DIP,16PIN,PLASTIC | IC,PARITY GENERATOR/CHECKER,DIP,16PIN,CERAMIC | IC,PARITY GENERATOR/CHECKER,DIP,16PIN,CERAMIC | IC,PARITY GENERATOR/CHECKER,DIP,16PIN,PLASTIC |
Maker | NXP | NXP | NXP | NXP | NXP | NXP |
package instruction | DIP, DIP16,.3 | QCCJ, LDCC20,.4SQ | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
JESD-30 code | R-XDIP-T16 | S-PQCC-J20 | R-PDIP-T16 | R-XDIP-T16 | R-XDIP-T16 | R-PDIP-T16 |
Logic integrated circuit type | PARITY GENERATOR/CHECKER | PARITY GENERATOR/CHECKER | PARITY GENERATOR/CHECKER | PARITY GENERATOR/CHECKER | PARITY GENERATOR/CHECKER | PARITY GENERATOR/CHECKER |
Number of terminals | 16 | 20 | 16 | 16 | 16 | 16 |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
Package body material | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | CERAMIC | PLASTIC/EPOXY |
encapsulated code | DIP | QCCJ | DIP | DIP | DIP | DIP |
Encapsulate equivalent code | DIP16,.3 | LDCC20,.4SQ | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 |
Package shape | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
surface mount | NO | YES | NO | NO | NO | NO |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal form | THROUGH-HOLE | J BEND | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
Terminal location | DUAL | QUAD | DUAL | DUAL | DUAL | DUAL |