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MPC5607BF0ACMG6

Description
32-BIT, FLASH, 64MHz, MICROCONTROLLER, PBGA208, 17 X 17 MM, 1 MM PITCH, MO-152AAF-1, ROHS COMPLIANT, MAPBGA-208
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size671KB,112 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Download Datasheet Parametric View All

MPC5607BF0ACMG6 Overview

32-BIT, FLASH, 64MHz, MICROCONTROLLER, PBGA208, 17 X 17 MM, 1 MM PITCH, MO-152AAF-1, ROHS COMPLIANT, MAPBGA-208

MPC5607BF0ACMG6 Parametric

Parameter NameAttribute value
MakerNXP
Parts packaging codeBGA
package instructionBGA,
Contacts208
Reach Compliance Codeunknown
Has ADCYES
Address bus width32
bit size32
maximum clock frequency16 MHz
DAC channelNO
DMA channelYES
External data bus width64
JESD-30 codeS-PBGA-B208
length17 mm
Number of I/O lines147
Number of terminals208
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
PWM channelYES
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Package shapeSQUARE
Package formGRID ARRAY
Certification statusNot Qualified
ROM programmabilityFLASH
Maximum seat height2 mm
speed64 MHz
Maximum supply voltage3.6 V
Minimum supply voltage3 V
Nominal supply voltage3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
width17 mm
uPs/uCs/peripheral integrated circuit typeMICROCONTROLLER
Freescale Semiconductor
Data Sheet: Technical Data
Document Number: MPC5607B
Rev. 7, 05/2013
MPC5607B
100 LQFP
14 mm x 14 mm
144 LQFP
20 mm x 20 mm
MPC5607B Microcontroller
Data Sheet
Single issue, 32-bit CPU core complex (e200z0h)
— Compliant with the Power Architecture
®
technology
embedded category
— Enhanced instruction set allowing variable length
encoding (VLE) for code size footprint reduction.
With the optional encoding of mixed 16-bit and
32-bit instructions, it is possible to achieve
significant code size footprint reduction.
Up to 1.5 MB on-chip code flash memory supported with
the flash memory controller and ECC
64 (4 × 16) KB on-chip data flash memory with ECC
Up to 96 KB on-chip SRAM with ECC
Memory protection unit (MPU) with 8 region descriptors
and 32-byte region granularity on certain family
members (Refer to
Table 1
for details.)
Interrupt controller (INTC) capable of handling 204
selectable-priority interrupt sources
Frequency modulated phase-locked loop (FMPLL)
Crossbar switch architecture for concurrent access to
peripherals, Flash, or RAM from multiple bus masters
16-channel eDMA controller with multiple transfer
request sources using DMA multiplexer
Boot assist module (BAM) supports internal Flash
programming via a serial link (CAN or SCI)
Timer supports I/O channels providing a range of 16-bit
input capture, output compare, and pulse width
modulation functions (eMIOS)
2 analog-to-digital converters (ADC): one 10-bit and one
12-bit
Cross Trigger Unit to enable synchronization of ADC
conversions with a timer event from the eMIOS or PIT
Up to 6 serial peripheral interface (DSPI) modules
Up to 10 serial communication interface (LINFlex)
modules
176 LQFP
24 mm x 24 mm
208 MAPBGA
17 mm x 17 mm
Up to 6 enhanced full CAN (FlexCAN) modules with
configurable buffers
1 inter-integrated circuit (I
2
C) interface module
Up to 149 configurable general purpose pins supporting
input and output operations (package dependent)
Real-Time Counter (RTC)
— Clock source from internal 128 kHz or 16 MHz
oscillator supporting autonomous wakeup with 1 ms
resolution with maximum timeout of 2 seconds
— Optional support for RTC with clock source from
external 32 kHz crystal oscillator, supporting
wakeup with 1 sec resolution and maximum timeout
of 1 hour
Up to 8 periodic interrupt timers (PIT) with 32-bit
counter resolution
Nexus development interface (NDI) per IEEE-ISTO
5001-2003 Class Two Plus
Device/board boundary scan testing supported per Joint
Test Action Group (JTAG) of IEEE (IEEE 1149.1)
On-chip voltage regulator (VREG) for regulation of input
supply for all internal levels
© Freescale Semiconductor, Inc., 2010-2013. All rights reserved.

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