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SFF50N50MUBTXV

Description
Power Field-Effect Transistor, 27A I(D), 500V, 0.175ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-254AA, HERMETIC SEALED, TO-254, 3 PIN
CategoryDiscrete semiconductor    The transistor   
File Size119KB,2 Pages
ManufacturerSSDI
Websitehttp://www.ssdi-power.com/
Download Datasheet Parametric View All

SFF50N50MUBTXV Overview

Power Field-Effect Transistor, 27A I(D), 500V, 0.175ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-254AA, HERMETIC SEALED, TO-254, 3 PIN

SFF50N50MUBTXV Parametric

Parameter NameAttribute value
MakerSSDI
Parts packaging codeTO-254AA
package instructionFLANGE MOUNT, S-XSFM-P3
Contacts3
Reach Compliance Codecompliant
Other featuresAVALANCHE RATED
Avalanche Energy Efficiency Rating (Eas)1500 mJ
Shell connectionISOLATED
ConfigurationSINGLE WITH BUILT-IN DIODE
Minimum drain-source breakdown voltage500 V
Maximum drain current (ID)27 A
Maximum drain-source on-resistance0.175 Ω
FET technologyMETAL-OXIDE SEMICONDUCTOR
JEDEC-95 codeTO-254AA
JESD-30 codeS-XSFM-P3
Number of components1
Number of terminals3
Operating modeENHANCEMENT MODE
Package body materialUNSPECIFIED
Package shapeSQUARE
Package formFLANGE MOUNT
Polarity/channel typeN-CHANNEL
Certification statusNot Qualified
surface mountNO
Terminal formPIN/PEG
Terminal locationSINGLE
transistor applicationsSWITCHING
Transistor component materialsSILICON
Solid State Devices, Inc.
14701 Firestone Blvd * La Mirada, Ca 90638
Phone: (562) 404-4474 * Fax: (562) 404-1773
ssdi@ssdi-power.com * www.ssdi-power.com
SFF27N50M
SFF27N50Z
1/
DESIGNER’S DATA SHEET
Part Number / Ordering Information
SFF27N50 ___ ___ ___
Screening
2/
__ = Not Screened
TX = TX Level
TXV = TXV Level
S = S Level
27 AMP , 500 Volts, 175 mΩ
Avalanche Rated N-channel
MOSFET
Features:
Rugged poly-Si gate
Lowest ON-resistance in the industry
Avalanche rated
Hermetically Sealed, Isolated Package
Low Total Gate Charge
Fast Switching
TX, TXV, S-Level screening available
Improved (R
DS(ON)
Q
G
) figure of merit
Lead Option
3/
Package
3/ 4/
M = TO-254
Z = TO-254Z
__ = Straight Leads
DB = Down Bend
UB = Up Bend
Maximum Ratings
Drain - Source Voltage
Gate – Source Voltage
Max. Continuous Drain Current (package
limited)
Max. Instantaneous Drain Current (Tj limited)
Max. Avalanche current
Single and Repetitive Avalanche Energy
Total Power Dissipation
Operating & Storage Temperature
Maximum Thermal Resistance
(Junction to Case)
NOTES:
*Pulse Test: Pulse Width = 300µsec, Duty Cycle = 2%.
1/ For ordering information, price, and availability - contact factory.
2/ Screening based on MIL-PRF-19500. Screening flows available
on request.
3/ For package outlines / lead bending options / pinout
configurations - contact factory.
4/ Maximum current limited by package configuration
o
5/ Unless otherwise specified, all electrical characteristics @25 C.
continuous
transient
Symbol
V
DSS
V
GS
I
D1
I
D2
I
D3
I
AR
E
AS
E
AR
P
D
T
OP
& T
STG
R
θJC
TO-254
Value
100
±20
±30
27
27
18
35
1500
50
100
-55 to +150
1.0
(typ.0.75)
Units
V
V
A
A
A
mJ
W
ºC
ºC /W
@ T
C
= 25ºC
@ T
C
= 25ºC
@ T
C
= 125ºC
@ L= 0.1 mH
@ L= 0.1 mH
@ T
C
= 25ºC
TO-254Z
NOTE:
All specifications are subject to change without notification.
SCD's for these devices should be reviewed by SSDI prior to release.
DATA SHEET #: F00165G
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