N16D1618LPAT2-60I datasheet, PDF

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N16D1618LPAT2-60I: DescriptionSynchronous DRAM, 1MX16, 5.5ns, CMOS, PDSO50, GREEN, TSOP2-50; Categorystorage storage; File Size214KB，29 Pages; ManufacturerIntegrated Silicon Solution ( ISSI ); Environmental Compliance

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N16D1618LPAT2-60I Overview

Synchronous DRAM, 1MX16, 5.5ns, CMOS, PDSO50, GREEN, TSOP2-50

N16D1618LPAT2-60I Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Integrated Silicon Solution ( ISSI )
package instruction	TSOP2, TSOP50,.46,32
Reach Compliance Code	compliant
access mode	DUAL BANK PAGE BURST
Maximum access time	5.5 ns
Other features	AUTO/SELF REFRESH
Maximum clock frequency (fCLK)	166 MHz
I/O type	COMMON
interleaved burst length	1,2,4,8
JESD-30 code	R-PDSO-G50
length	20.95 mm
memory density	16777216 bit
Memory IC Type	SYNCHRONOUS DRAM
memory width	16
Number of functions	1
Number of ports	1
Number of terminals	50
word count	1048576 words
character code	1000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-25 °C
organize	1MX16
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	TSOP2
Encapsulate equivalent code	TSOP50,.46,32
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE
power supply	1.8 V
Certification status	Not Qualified
refresh cycle	4096
Maximum seat height	1.2 mm
self refresh	YES
Continuous burst length	1,2,4,8,FP
Maximum standby current	0.00001 A
Maximum slew rate	0.055 mA
Maximum supply voltage (Vsup)	1.95 V
Minimum supply voltage (Vsup)	1.65 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	OTHER
Terminal form	GULL WING
Terminal pitch	0.8 mm
Terminal location	DUAL
width	10.16 mm

N16D1618LPAT2-60I Related Products

	N16D1618LPAT2-60I	N16D1618LPAT2-75I
Description	Synchronous DRAM, 1MX16, 5.5ns, CMOS, PDSO50, GREEN, TSOP2-50	Synchronous DRAM, 1MX16, 6ns, CMOS, PDSO50, GREEN, TSOP2-50
Is it Rohs certified?	conform to	conform to
Maker	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )
package instruction	TSOP2, TSOP50,.46,32	TSOP2, TSOP50,.46,32
Reach Compliance Code	compliant	compliant
access mode	DUAL BANK PAGE BURST	DUAL BANK PAGE BURST
Maximum access time	5.5 ns	6 ns
Other features	AUTO/SELF REFRESH	AUTO/SELF REFRESH
Maximum clock frequency (fCLK)	166 MHz	133 MHz
I/O type	COMMON	COMMON
interleaved burst length	1,2,4,8	1,2,4,8
JESD-30 code	R-PDSO-G50	R-PDSO-G50
length	20.95 mm	20.95 mm
memory density	16777216 bit	16777216 bit
Memory IC Type	SYNCHRONOUS DRAM	SYNCHRONOUS DRAM
memory width	16	16
Number of functions	1	1
Number of ports	1	1
Number of terminals	50	50
word count	1048576 words	1048576 words
character code	1000000	1000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	85 °C
Minimum operating temperature	-25 °C	-25 °C
organize	1MX16	1MX16
Output characteristics	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TSOP2	TSOP2
Encapsulate equivalent code	TSOP50,.46,32	TSOP50,.46,32
Package shape	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE
power supply	1.8 V	1.8 V
Certification status	Not Qualified	Not Qualified
refresh cycle	4096	4096
Maximum seat height	1.2 mm	1.2 mm
self refresh	YES	YES
Continuous burst length	1,2,4,8,FP	1,2,4,8,FP
Maximum standby current	0.00001 A	0.00001 A
Maximum slew rate	0.055 mA	0.045 mA
Maximum supply voltage (Vsup)	1.95 V	1.95 V
Minimum supply voltage (Vsup)	1.65 V	1.65 V
Nominal supply voltage (Vsup)	1.8 V	1.8 V
surface mount	YES	YES
technology	CMOS	CMOS
Temperature level	OTHER	OTHER
Terminal form	GULL WING	GULL WING
Terminal pitch	0.8 mm	0.8 mm
Terminal location	DUAL	DUAL
width	10.16 mm	10.16 mm

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