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BZD27C200P-G2

Description
DIODE 200 V, 0.8 W, SILICON, UNIDIRECTIONAL VOLTAGE REGULATOR DIODE, DO-219AB, PLASTIC, SMF, 2 PIN, Voltage Regulator Diode
CategoryDiscrete semiconductor    diode   
File Size171KB,6 Pages
ManufacturerVishay
Websitehttp://www.vishay.com
Environmental Compliance  
Download Datasheet Parametric View All

BZD27C200P-G2 Overview

DIODE 200 V, 0.8 W, SILICON, UNIDIRECTIONAL VOLTAGE REGULATOR DIODE, DO-219AB, PLASTIC, SMF, 2 PIN, Voltage Regulator Diode

BZD27C200P-G2 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerVishay
Parts packaging codeDO-219AB
package instructionR-PDSO-F2
Contacts2
Reach Compliance Codeunknown
ECCN codeEAR99
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeZENER DIODE
JEDEC-95 codeDO-219AB
JESD-30 codeR-PDSO-F2
JESD-609 codee3
Humidity sensitivity level1
Number of components1
Number of terminals2
Maximum operating temperature150 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)260
polarityUNIDIRECTIONAL
Maximum power dissipation0.8 W
Certification statusNot Qualified
Nominal reference voltage200 V
surface mountYES
technologyZENER
Terminal surfaceMatte Tin (Sn)
Terminal formFLAT
Terminal locationDUAL
Maximum time at peak reflow temperature40
Maximum voltage tolerance6%
Working test current5 mA
VISHAY
BZD27C3V6P to BZD27C200P
Vishay Semiconductors
Voltage Regulator Diodes
Features
Sillicon Planar Zener Diodes
Low profile surface-mount package
Zener and surge current specification
Low leakage current
Excellent stability
High temperature soldering:
260 °C/10 sec. at terminals
17249
Mechanical Data
Case:
JEDEC DO-219AB (SMF
®
) Plastic Case
Packaging codes/options:
G1/ 10 K per 13 " reel, (8 mm tape), 50 K/box
G2/ 3 K per 7 " reel, (8 mm tape), 30 K/box
Weight:
approx. 10 mg
Absolute Maximum Ratings
T
amb
= 25 °C, unless otherwise specified
Parameter
Power dissipation
Test condition
T
L
= 80 °C
T
A
= 25 °C
Non-repetitive peak pulse power 100
µs
square pulse
2)
dissipation
10/1000
µs
waveform (BZD27-
C7V5P to
C110P to
1)
2)
Symbol
P
tot
P
tot
P
ZSM
P
RSM
P
RSM
Value
2.3
0.8
1)
300
150
100
Unit
W
W
W
W
W
BZD27-C100P)
2)
BZD27-C200P)
2)
10/1000
µs
waveform (BZD27-
Mounted on epoxy-glass PCB with 3 x 3 mm Cu pads (≥ 40
µm
thick)
T
J
= 25 °C prior to surge
Thermal Characteristics
T
amb
= 25 °C, unless otherwise specified
Parameter
Thermal resistance junction to ambient air
1)
Thermal resistance junction to lead
Maximum junction temperature
Storage temperature range
1)
Test condition
Symbol
R
θ
JA
R
θ
JL
T
j
T
S
Value
180
30
150
- 55 to + 150
Unit
K/W
K/W
°C
°C
Mounted on epoxy-glass PCB with 3 x 3 mm Cu pads (≥ 40
µm
thick)
Electrical Characteristics
T
amb
= 25 °C, unless otherwise specified
Parameter
Forward voltage
Test condition
I
F
= 0.2 A
Symbol
V
F
Min
Typ.
Max
1.2
Unit
V
Document Number 85810
Rev. 4, 16-Sep-03
www.vishay.com
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