Field Programmable Gate Array, 3844 CLBs, 1250000 Gates, CMOS, PBGA900, FPBGA-900
Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Maker | Lattice |
Parts packaging code | BGA |
package instruction | FPBGA-900 |
Contacts | 900 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
Combined latency of CLB-Max | 0.93 ns |
JESD-30 code | S-PBGA-B900 |
JESD-609 code | e1 |
length | 31 mm |
Humidity sensitivity level | 3 |
Configurable number of logic blocks | 3844 |
Equivalent number of gates | 1250000 |
Number of terminals | 900 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 3844 CLBS, 1250000 GATES |
Package body material | PLASTIC/EPOXY |
encapsulated code | BGA |
Package shape | SQUARE |
Package form | GRID ARRAY |
Peak Reflow Temperature (Celsius) | 250 |
Programmable logic type | FIELD PROGRAMMABLE GATE ARRAY |
Certification status | Not Qualified |
Maximum seat height | 2.6 mm |
Maximum supply voltage | 1.95 V |
Minimum supply voltage | 1.65 V |
Nominal supply voltage | 1.8 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
Terminal form | BALL |
Terminal pitch | 1 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | 40 |
width | 31 mm |