Consumer Circuit, CMOS, DIE-14
Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | Pericom Semiconductor Corporation (Diodes Incorporated) |
Parts packaging code | DIE |
package instruction | DIE, |
Contacts | 14 |
Reach Compliance Code | compliant |
ECCN code | EAR99 |
Commercial integrated circuit types | CONSUMER CIRCUIT |
JESD-30 code | R-XUUC-N14 |
JESD-609 code | e3 |
Number of functions | 1 |
Number of terminals | 14 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
Package body material | UNSPECIFIED |
encapsulated code | DIE |
Package shape | RECTANGULAR |
Package form | UNCASED CHIP |
Peak Reflow Temperature (Celsius) | 260 |
Certification status | Not Qualified |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | MATTE TIN |
Terminal form | NO LEAD |
Terminal location | UPPER |
Maximum time at peak reflow temperature | NOT SPECIFIED |
PT8A9731DE | PT8A9701DE | PT8A9731P | PT8A9731W | |
---|---|---|---|---|
Description | Consumer Circuit, CMOS, DIE-14 | Consumer Circuit, CMOS, DIE-16 | Consumer Circuit, CMOS, PDIP14, PLASTIC, DIP-14 | Consumer Circuit, CMOS, PDSO14, SOIC-14 |
Is it lead-free? | Lead free | Lead free | Contains lead | Contains lead |
Is it Rohs certified? | conform to | conform to | incompatible | incompatible |
Maker | Pericom Semiconductor Corporation (Diodes Incorporated) | Pericom Semiconductor Corporation (Diodes Incorporated) | Pericom Semiconductor Corporation (Diodes Incorporated) | Pericom Semiconductor Corporation (Diodes Incorporated) |
Parts packaging code | DIE | DIE | DIP | SOIC |
package instruction | DIE, | DIE, | DIP, | SOP, |
Contacts | 14 | 16 | 14 | 14 |
Reach Compliance Code | compliant | compliant | compliant | compliant |
ECCN code | EAR99 | EAR99 | EAR99 | EAR99 |
Commercial integrated circuit types | CONSUMER CIRCUIT | CONSUMER CIRCUIT | CONSUMER CIRCUIT | CONSUMER CIRCUIT |
JESD-30 code | R-XUUC-N14 | R-XUUC-N16 | R-PDIP-T14 | R-PDSO-G14 |
JESD-609 code | e3 | e3 | e0 | e0 |
Number of functions | 1 | 1 | 1 | 1 |
Number of terminals | 14 | 16 | 14 | 14 |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C |
Package body material | UNSPECIFIED | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | DIE | DIE | DIP | SOP |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | UNCASED CHIP | UNCASED CHIP | IN-LINE | SMALL OUTLINE |
Peak Reflow Temperature (Celsius) | 260 | 260 | 240 | 240 |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
surface mount | YES | YES | NO | YES |
technology | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal surface | MATTE TIN | MATTE TIN | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | NO LEAD | NO LEAD | THROUGH-HOLE | GULL WING |
Terminal location | UPPER | UPPER | DUAL | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |