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EP2A25F1020C9

Description
Loadable PLD, 2.23ns, CMOS, PBGA1020, 33 X 33 MM, 1 MM PITCH, FINE LINE, BGA-1020
CategoryProgrammable logic devices    Programmable logic   
File Size1MB,94 Pages
ManufacturerAltera (Intel)
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EP2A25F1020C9 Overview

Loadable PLD, 2.23ns, CMOS, PBGA1020, 33 X 33 MM, 1 MM PITCH, FINE LINE, BGA-1020

EP2A25F1020C9 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerAltera (Intel)
Parts packaging codeBGA
package instructionHBGA,
Contacts1020
Reach Compliance Codecompliant
ECCN code3A001.A.7.A
JESD-30 codeS-PBGA-B1020
JESD-609 codee0
length33 mm
Number of I/O lines612
Number of terminals1020
Maximum operating temperature70 °C
Minimum operating temperature
organize612 I/O
Output functionMACROCELL
Package body materialPLASTIC/EPOXY
encapsulated codeHBGA
Package shapeSQUARE
Package formGRID ARRAY, HEAT SINK/SLUG
Peak Reflow Temperature (Celsius)220
Programmable logic typeLOADABLE PLD
propagation delay2.23 ns
Certification statusNot Qualified
Maximum seat height3.5 mm
Maximum supply voltage1.575 V
Minimum supply voltage1.425 V
Nominal supply voltage1.5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTIN LEAD
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature30
width33 mm
APEX II
®
Programmable Logic
Device Family
Data Sheet
November 2001, ver. 1.2
Features...
I
I
I
Programmable logic device (PLD) manufactured using a 0.15-µm all-
layer copper-metal fabrication process (up to eight layers of metal)
1-gigabit per second (Gbps) True-LVDS
TM
, LVPECL, pseudo
current mode logic (PCML), and HyperTransport interface
– Clock-data synchronization (CDS) in True-LVDS interface to
correct any fixed clock-to-data skew
– Enables common networking and communications bus I/O
standards such as RapidIO, CSIX, Utopia IV, and POS-PHY
Level 4
– Support for high-speed external memory interfaces, including
zero bus turnaround (ZBT), quad data rate (QDR), and double
data rate (DDR) static RAM (SRAM), and single data rate (SDR)
and DDR synchronous dynamic RAM (SDRAM)
– 30% to 40% faster design performance than APEX
TM
20KE
devices on average
– Enhanced 4,096-bit embedded system blocks (ESBs)
implementing first-in first-out (FIFO) buffers, Dual-Port+ RAM
(bidirectional dual-port RAM), and content-addressable
memory (CAM)
– High-performance, low-power copper interconnect
– Fast parallel byte-wide synchronous device configuration
– Look-up table (LUT) logic available for register-intensive
functions
High-density architecture
– 1,900,000 to 5,250,000 maximum system gates (see
Table 1)
Up to 67,200 logic elements (LEs)
Up to 1,146,880 RAM bits that can be used without reducing
available logic
Low-power operation design
– 1.5-V supply voltage
– Copper interconnect reduces power consumption
– MultiVolt
TM
I/O support for 1.5-V, 1.8-V, 2.5-V, and 3.3-V
interfaces
– ESBs offer programmable power-saving mode
Altera Corporation
A-DS-APEXII-1.2
1

EP2A25F1020C9 Related Products

EP2A25F1020C9 EP2A25F1020C7
Description Loadable PLD, 2.23ns, CMOS, PBGA1020, 33 X 33 MM, 1 MM PITCH, FINE LINE, BGA-1020 Loadable PLD, 1.69ns, CMOS, PBGA1020, 33 X 33 MM, 1 MM PITCH, FINE LINE, BGA-1020
Is it lead-free? Contains lead Contains lead
Is it Rohs certified? incompatible incompatible
Maker Altera (Intel) Altera (Intel)
Parts packaging code BGA BGA
package instruction HBGA, HBGA,
Contacts 1020 1020
Reach Compliance Code compliant compliant
ECCN code 3A001.A.7.A 3A001.A.7.A
JESD-30 code S-PBGA-B1020 S-PBGA-B1020
JESD-609 code e0 e0
length 33 mm 33 mm
Number of I/O lines 612 612
Number of terminals 1020 1020
Maximum operating temperature 70 °C 70 °C
organize 612 I/O 612 I/O
Output function MACROCELL MACROCELL
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code HBGA HBGA
Package shape SQUARE SQUARE
Package form GRID ARRAY, HEAT SINK/SLUG GRID ARRAY, HEAT SINK/SLUG
Peak Reflow Temperature (Celsius) 220 220
Programmable logic type LOADABLE PLD LOADABLE PLD
propagation delay 2.23 ns 1.69 ns
Certification status Not Qualified Not Qualified
Maximum seat height 3.5 mm 3.5 mm
Maximum supply voltage 1.575 V 1.575 V
Minimum supply voltage 1.425 V 1.425 V
Nominal supply voltage 1.5 V 1.5 V
surface mount YES YES
technology CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL
Terminal surface TIN LEAD TIN LEAD
Terminal form BALL BALL
Terminal pitch 1 mm 1 mm
Terminal location BOTTOM BOTTOM
Maximum time at peak reflow temperature 30 30
width 33 mm 33 mm

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