PI7C8150ANDE-33 datasheet, PDF

PI7C8150ANDE-33: DescriptionPCI Bus Controller, CMOS, PBGA256, PLASTIC, BGA-256; CategoryThe embedded processor and controller Microcontrollers and processors; File Size2MB，111 Pages; ManufacturerDiodes; Websitehttp://www.diodes.com/; Environmental Compliance

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PI7C8150ANDE-33 Overview

PCI Bus Controller, CMOS, PBGA256, PLASTIC, BGA-256

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Diodes
package instruction	BGA,
Reach Compliance Code	compliant
ECCN code	EAR99
Address bus width	32
maximum clock frequency	33 MHz
External data bus width	32
JESD-30 code	S-PBGA-B256
JESD-609 code	e1
length	17 mm
Humidity sensitivity level	3
Number of terminals	256
Maximum operating temperature	85 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Package shape	SQUARE
Package form	GRID ARRAY
Peak Reflow Temperature (Celsius)	260
Certification status	Not Qualified
Maximum seat height	1.76 mm
Maximum supply voltage	3.6 V
Minimum supply voltage	3 V
Nominal supply voltage	3.3 V
surface mount	YES
technology	CMOS
Temperature level	OTHER
Terminal surface	TIN SILVER COPPER
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	40
width	17 mm
uPs/uCs/peripheral integrated circuit type	BUS CONTROLLER, PCI

	PI7C8150ANDE-33	PI7C8150AND-33E	PI7C8150AMA-33E
Description	PCI Bus Controller, CMOS, PBGA256, PLASTIC, BGA-256	PCI Bus Controller, CMOS, PBGA256, PLASTIC, BGA-256	PCI Bus Controller, CMOS, PQFP208, FQFP-208
Is it Rohs certified?	conform to	conform to	conform to
Maker	Diodes	Diodes	Diodes
package instruction	BGA,	BGA,	FQFP,
Reach Compliance Code	compliant	compliant	compliant
ECCN code	EAR99	EAR99	EAR99
Address bus width	32	32	32
maximum clock frequency	33 MHz	33 MHz	33 MHz
External data bus width	32	32	32
JESD-30 code	S-PBGA-B256	S-PBGA-B256	S-PQFP-G208
JESD-609 code	e1	e1	e3
length	17 mm	17 mm	28 mm
Humidity sensitivity level	3	3	3
Number of terminals	256	256	208
Maximum operating temperature	85 °C	85 °C	85 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	BGA	BGA	FQFP
Package shape	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY	GRID ARRAY	FLATPACK, FINE PITCH
Peak Reflow Temperature (Celsius)	260	260	245
Certification status	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.76 mm	1.76 mm	3.8 mm
Maximum supply voltage	3.6 V	3.6 V	3.6 V
Minimum supply voltage	3 V	3 V	3 V
Nominal supply voltage	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES
technology	CMOS	CMOS	CMOS
Temperature level	OTHER	OTHER	OTHER
Terminal surface	TIN SILVER COPPER	TIN SILVER COPPER	MATTE TIN
Terminal form	BALL	BALL	GULL WING
Terminal pitch	1 mm	1 mm	0.5 mm
Terminal location	BOTTOM	BOTTOM	QUAD
Maximum time at peak reflow temperature	40	40	40
width	17 mm	17 mm	28 mm
uPs/uCs/peripheral integrated circuit type	BUS CONTROLLER, PCI	BUS CONTROLLER, PCI	BUS CONTROLLER, PCI

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