Standard SRAM, 512KX32, 6.5ns, CMOS, PBGA165, BGA-165
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Integrated Silicon Solution ( ISSI ) |
| Parts packaging code | BGA |
| package instruction | BGA, |
| Contacts | 165 |
| Reach Compliance Code | compliant |
| ECCN code | 3A991.B.2.A |
| Maximum access time | 6.5 ns |
| Other features | FLOW-THROUGH OR PIPELINED ARCHITECTURE |
| JESD-30 code | R-PBGA-B165 |
| JESD-609 code | e0 |
| length | 15 mm |
| memory density | 16777216 bit |
| Memory IC Type | STANDARD SRAM |
| memory width | 32 |
| Number of functions | 1 |
| Number of terminals | 165 |
| word count | 524288 words |
| character code | 512000 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 512KX32 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | BGA |
| Package shape | RECTANGULAR |
| Package form | GRID ARRAY |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Certification status | Not Qualified |
| Maximum seat height | 1.2 mm |
| Maximum supply voltage (Vsup) | 2.625 V |
| Minimum supply voltage (Vsup) | 2.375 V |
| Nominal supply voltage (Vsup) | 2.5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | TIN LEAD |
| Terminal form | BALL |
| Terminal pitch | 1 mm |
| Terminal location | BOTTOM |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 13 mm |
EEWorld
subscription
account
EEWorld
service
account
Automotive
development
circle
京公网安备 11010802033920号
EEWORLD